Evan Lawrence Erickson

Works (4)

Updated: July 5th, 2023 15:57

2013 conference paper

A compact inductively coupled connector for mobile devices

2013 IEEE 63rd Electronic Components and Technology Conference (ECTC), 2385–2390.

By: W. Zhao  n, P. Gadfort n, E. Erickson n & P. Franzon n 

topics (OpenAlex): 3D IC and TSV technologies; Electronic Packaging and Soldering Technologies; Semiconductor Lasers and Optical Devices
TL;DR: A nested inductive connector, consisting of a single power channel and one or more data channels, is proposed as replacement for legacy conductive connectors in mobile devices, with advantages include minimized space in the mobile device, waterproofing, orientation independence, and resistance to stress through a breakaway mechanism. (via Semantic Scholar)
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Sources: NC State University Libraries, NC State University Libraries
Added: August 6, 2018

2009 conference paper

Multi-bit fractional equalization for multi-Gb/s inductively coupled connectors

Electrical Performance of Electronic Packaging and Systems, 121–124.

By: E. Erickson n, J. Wilson *, K. Chandrasekar* & P. Franzon n 

topics (OpenAlex): Semiconductor Lasers and Optical Devices; Semiconductor materials and devices; 3D IC and TSV technologies
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7. Affordable and Clean Energy (OpenAlex)
Sources: NC State University Libraries, NC State University Libraries
Added: August 6, 2018

2008 conference paper

Inductively coupled connectors and sockets for multi-Gb/s pulse signaling

IEEE Transactions on Advanced Packaging, 31(4), 749–758.

By: K. Chandrasekar n, J. Wilson n, E. Erickson n, Z. Feng n, J. Xu n, S. Mick n, P. Franzon n 

topics (OpenAlex): Semiconductor Lasers and Optical Devices; 3D IC and TSV technologies; Advancements in PLL and VCO Technologies
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Sources: NC State University Libraries, NC State University Libraries
Added: August 6, 2018

2004 article

AC coupled interconnect for dense 3-D ICs

Xu, J., Mick, S., Wilson, J., Luo, L., Chandrasekar, K., Erickson, E., & Franzon, P. D. (2004, October). IEEE TRANSACTIONS ON NUCLEAR SCIENCE, Vol. 51, pp. 2156–2160.

By: J. Xu n, S. Mick n, J. Wilson n, L. Luo n, K. Chandrasekar n, E. Erickson n, P. Franzon n 

author keywords: AC coupled; inductive coupling; spiral inductor; three-dimensional integrated circuits (3-D ICs); through vias; vertical interconnect
topics (OpenAlex): 3D IC and TSV technologies; Semiconductor Lasers and Optical Devices; Photonic and Optical Devices
TL;DR: This paper presents the potential application of AC coupled interconnect (ACCI) for dense three-dimensional (3-D) integrated circuits (ICs) and concludes that inductive ACCI can provide small pitch vertical interconnects, as well as an excellent thermal solution for dense 3-D ICs. (via Semantic Scholar)
UN Sustainable Development Goals Color Wheel
UN Sustainable Development Goal Categories
7. Affordable and Clean Energy (OpenAlex)
Sources: Web Of Science, NC State University Libraries
Added: August 6, 2018

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