Displaying all 9 works
Sorted by most recent date added to the index first, which may not be the same as publication date order.
1993 journal article
Two-dimensional crystallization [6]
http://www.scopus.com/inward/record.url?eid=2-s2.0-33745795670&partnerID=MN8TOARS
Contributors: N. Denkov, O. Velev , P. Kralchevsky, I. Ivanov, H. Yoshimura & K. Nagayama
1993 journal article
Spontaneous Cyclic Dimpling in Emulsion Films Due to Surfactant Mass Transfer between the Phases
Journal of Colloid And Interface Science, 159(2), 497–501.
Contributors: O. Velev* , T. Gurkov * & R. Borwankar*
1993 book
Mechanism of formation of two-dimensional crystals from latex particles on substrata
In Progress in Colloid & Polymer Science (Vol. 93, pp. 366–367). http://www.scopus.com/inward/record.url?eid=2-s2.0-0027735706&partnerID=MN8TOARS
Contributors: O. Velev , N. Denkov, P. Kralchevsky, I. Ivanov, H. Yoshimura & K. Nagayama
1993 journal article
Direct measurement of lateral capillary forces
Langmuir, 9(12), 3702–3709. http://www.scopus.com/inward/record.url?eid=2-s2.0-0027877959&partnerID=MN8TOARS
Contributors: O. Velev , N. Denkov, V. Paunov, P. Kralchevsky & K. Nagayama
1993 conference paper
Novel approaches for the real-time prediction of dye concentrations in three dye mixtures
Book of papers. Presented at the Queen Elizabeth Hotel, Montreal, Quebec, Canada. Queen Elizabeth Hotel, Montreal, Quebec, Canada: Research Triangle Park, N.C. : American Association of Textile Chemists and Colorists.
Event: at Queen Elizabeth Hotel, Montreal, Quebec, Canada
1993 journal article
USING NEURAL NETWORKS TO PREDICT DYE CONCENTRATIONS IN MULTIPLE-DYE MIXTURES
TEXTILE RESEARCH JOURNAL, 63(9), 545–551.
1993 patent
Selective deposition of doped silion-germanium alloy on semiconductor substrate
Washington, DC: U.S. Patent and Trademark Office.
1993 patent
Deposition of germanium thin films on silicon dioxide employing interposed polysilicon laye
Washington, DC: U.S. Patent and Trademark Office.
1993 journal article
CENTER FOR ADVANCED ELECTRONIC MATERIALS PROCESSING
PROCEEDINGS OF THE IEEE, 81(1), 42–59.
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