Center for Additive Manufacturing and Logistics

Works Published in 2025

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Displaying all 6 works

Sorted by most recent date added to the index first, which may not be the same as publication date order.

2025 article

Evaluating the Implementation of Operational Readiness and Maintenance Policies in US Army Aviation

Semmel, A., Heese, H., & McConnell, B. (2025, February 10).

By: A. Semmel, H. Heese & B. McConnell 

Source: ORCID
Added: February 10, 2025

2025 review

Multi-scale assembly and structure-process-property relationships in nanocellulosic materials

[Review of ]. PROGRESS IN MATERIALS SCIENCE, 151.

By: M. Jamal, A. Benkaddour, L. Pal* , H. Sehaqui, L. Lucia* , S. Eichhorn, Y. Habibi*

Sources: Web Of Science, NC State University Libraries
Added: February 10, 2025

2025 article

Renovating Recycled Fibres Using High-Shear Homogenization for Sustainable Packaging and Other Bioproducts

Debnath, M., Salem, K. S., Musten, E., Lucian, L., Hubbe, M. A., & Pal, L. (2025, January 15). PACKAGING TECHNOLOGY AND SCIENCE, Vol. 1.

By: M. Debnath n, K. Salem n , E. Musten, L. Lucian  n, M. Hubbe n & L. Pal n 

author keywords: drainage; homogenization; packaging; refining; strength; sustainable development
Sources: Web Of Science, NC State University Libraries
Added: January 27, 2025

2025 review

Mechanisms and strategic prospects of cannabinoids use: Potential applications in antimicrobial food packaging-A review

[Review of ]. COMPREHENSIVE REVIEWS IN FOOD SCIENCE AND FOOD SAFETY, 24(1).

By: M. Dey n, S. Bera n, P. Tyagi n  & L. Pal n 

author keywords: active packaging; food safety; industrial hemp; inhibition mechanism; sustained release
Sources: Web Of Science, NC State University Libraries
Added: January 27, 2025

2025 journal article

Air movement operations planning heuristic improvement

Journal of Defense Analytics and Logistics.

By: R. Nelson *, J. Werner n, R. Daniels n, M. Kay  n, R. King  n, B. McConnell n , K. Thoney-Barletta  n

Source: ORCID
Added: January 16, 2025

2025 journal article

Co-Design and ML-Based Optimization of Through-Via in Silicon and Glass Interposers for Electronic Packaging Applications

IEEE Transactions on Components, Packaging and Manufacturing Technology.

By: P. Zaghari, S. Sinha, D. Hopkins*  & J. Ryu

Source: ORCID
Added: January 8, 2025

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