Center for Additive Manufacturing and Logistics

Works Published in 2025

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2025 journal article

Co-Design and ML-Based Optimization of Through-Via in Silicon and Glass Interposers for Electronic Packaging Applications

IEEE Transactions on Components, Packaging and Manufacturing Technology.

By: P. Zaghari, S. Sinha, D. Hopkins  & J. Ryu

Source: ORCID
Added: January 8, 2025

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