Center for Additive Manufacturing and Logistics

Performance tradeoffs for spare parts supply chains with additive manufacturing capability servicing intermittent demand

Journal of Defense Analytics and Logistics, ahead-of-print(ahead-of-print).

Liquid Metal Composites with Enhanced Thermal Conductivity and Stability Using Molecular Thermal Linker

Advanced Materials, 9, 2103104.

Study of Al wire bonds to understand cross-talk and current carrying capacity in WBG Power Module Design

Mehrotra, U., Morgan, A. J., McKeown, M., & Hopkins, D. C. (2021, April 26). Presented at the IMAPS International Advanced Power Electronics Packaging Symposium (APEPS’21).

Thermal Performance Comparison of DBC and ERCD for Single- and Double-Sided Power Modules

Cheng, T.-H., & Hopkins, D. C. (2021, April 26). Presented at the IMAPS International Advanced Power Electronics Packaging Symposium (APEPS’21).

Advances in Highly Thermally Conductive Organic Power Packaging

Hopkins, D. C., Cheng, T.-H., & Mehrotra, U. (2021, April 26). Presented at the IMAPS International Advanced Power Electronics Packaging Symposium (APEPS’21).

Advanced Dual-Sided Half-bridge Packaging with Epoxy Insulated Metal Substrates (eIMS)

Hopkins, D. C., Cheng, T.-H., Mehrotra, U., & Yu, W. (2021, June 14). Presented at the IEEE Applied Power Electronics Conference.

Optimized AC/DC Dual Active Bridge Converter using Monolithic SiC Bidirectional FET (BiDFET) for PV Applications

Shah, S. S., Bhattacharya, S., Kanale, A., Cheng, T.-H., Mehrotra, U., Agarwal, A., … Hopkins, D. C. (2021, October 10). Presented at the IEEE Energy Conversion Congress and Exposition, Vancouver, Canada.

Accessible & Adaptable Approach for Calculating the Thermal Resistance of a Power Package using ParaPower

Maru, K., & Hopkins, D. C. (2021, March 17). Accessible & Adaptable Approach for Calculating the Thermal Resistance of a Power Package using ParaPower. Presented at the FREEDM System Center Annual Research Symposium, Raleigh, NC.

E-Field Reduction Techniques in HV Multi-layered Modules Using New Capacitive Modelling Method

Sinha, S. S., & Hopkins, D. C. (2021, March 17). Presented at the FREEDM System Center Annual Research Symposium, Raleigh, NC.

Scalable Cascaded SuperCascode High Voltage Power Switch

Mehrotra, U., & Hopkins, D. C. (2021, March 17). Presented at the FREEDM System Center Annual Research Symposium, Raleigh, NC.

A 40kV/mm Organic Substrate for Low Voltage Power SiP and >10kV Power Modules

Hopkins, D. C., Yu, W., Mehrotra, U., Cheng, T.-H., Sinha, S. S., Maru, K., & Mescia, N. (2021, March 17). A 40kV/mm Organic Substrate for Low Voltage Power SiP and >10kV Power Modules. Presented at the FREEDM System Center Annual Research Symposium, Raleigh, NC.

A New Cascaded SuperCascode High Voltage Power Switch

2021 IEEE Applied Power Electronics Conference and Exposition (APEC). Presented at the 2021 IEEE Applied Power Electronics Conference and Exposition (APEC), Phoenix, AZ.

Bidirectional Solid-State Circuit Breaker using Super Cascode for MV SST and Energy Storage Systems

IEEE Journal of Emerging and Selected Topics in Power Electronics, 1–1.

Switching Characteristics of a 1.2 kV, 50 mΩ SiC Monolithic Bidirectional Field Effect Transistor (BiDFET) with Integrated JBS Diodes

2021 IEEE Applied Power Electronics Conference and Exposition (APEC). Presented at the 2021 IEEE Applied Power Electronics Conference and Exposition (APEC).

Design and Characterization of 3.3 kV-15 kV rated DBC Power Modules for Developmental Testing of WBG devices

2021 IEEE Applied Power Electronics Conference and Exposition (APEC). Presented at the 2021 IEEE Applied Power Electronics Conference and Exposition (APEC).

A Soft Variable-Area Electrical-Double-Layer Energy Harvester

Vallem, V., Roosa, E., Ledinh, T., Jung, W., Kim, T.-il, Rashid-Nadimi, S., … Dickey, M. D. (2021, August 31). ADVANCED MATERIALS, Vol. 8.

Gallium Liquid Metal: The Devil's Elixir

ANNUAL REVIEW OF MATERIALS RESEARCH, VOL 51, 2021.

Processing of tungsten through electron beam melting *

JOURNAL OF NUCLEAR MATERIALS, 11.

A Microvascular-Based Multifunctional and Reconfigurable Metamaterial

Devi, U., Pejman, R., Phillips, Z. J., Zhang, P., Soghrati, S., Nakshatrala, K. B., … Patrick, J. F. (2021, August 16). ADVANCED MATERIALS TECHNOLOGIES.

3-D Prismatic Packaging Methodologies for Wide Band Gap Power Electronics Modules

IEEE TRANSACTIONS ON POWER ELECTRONICS, 11.