Center for Additive Manufacturing and Logistics

College of Engineering

Works Published in 2021

Sorted by most recent date added to the index first, which may not be the same as publication date order.

2021 journal article

Performance tradeoffs for spare parts supply chains with additive manufacturing capability servicing intermittent demand

Journal of Defense Analytics and Logistics, ahead-of-print(ahead-of-print).

By: K. McDermott, R. Winz, T. Hodgson, M. Kay, R. King & B. McConnell

Source: ORCID
Added: September 14, 2021

2021 journal article

Liquid Metal Composites with Enhanced Thermal Conductivity and Stability Using Molecular Thermal Linker

Advanced Materials, 9, 2103104.

By: H. Wang, W. Xing, S. Chen, C. Song, M. Dickey & T. Deng

Source: ORCID
Added: September 13, 2021

2021 conference paper

Study of Al wire bonds to understand cross-talk and current carrying capacity in WBG Power Module Design

Mehrotra, U., Morgan, A. J., McKeown, M., & Hopkins, D. C. (2021, April 26). Presented at the IMAPS International Advanced Power Electronics Packaging Symposium (APEPS’21).

By: U. Mehrotra, A. Morgan, M. McKeown & D. Hopkins

Event: IMAPS International Advanced Power Electronics Packaging Symposium (APEPS’21) on April 26-29, 2021

Source: NC State University Libraries
Added: September 9, 2021

2021 conference paper

Thermal Performance Comparison of DBC and ERCD for Single- and Double-Sided Power Modules

Cheng, T.-H., & Hopkins, D. C. (2021, April 26). Presented at the IMAPS International Advanced Power Electronics Packaging Symposium (APEPS’21).

By: T. Cheng & D. Hopkins

Event: IMAPS International Advanced Power Electronics Packaging Symposium (APEPS’21) on April 26-29, 2021

Source: NC State University Libraries
Added: September 9, 2021

2021 conference paper

Advances in Highly Thermally Conductive Organic Power Packaging

Hopkins, D. C., Cheng, T.-H., & Mehrotra, U. (2021, April 26). Presented at the IMAPS International Advanced Power Electronics Packaging Symposium (APEPS’21).

By: D. Hopkins, T. Cheng & U. Mehrotra

Event: IMAPS International Advanced Power Electronics Packaging Symposium (APEPS’21) on April 26-29, 2021

Source: NC State University Libraries
Added: September 9, 2021

2021 conference paper

Advanced Dual-Sided Half-bridge Packaging with Epoxy Insulated Metal Substrates (eIMS)

Hopkins, D. C., Cheng, T.-H., Mehrotra, U., & Yu, W. (2021, June 14). Presented at the IEEE Applied Power Electronics Conference.

By: D. Hopkins, T. Cheng, U. Mehrotra & W. Yu

Event: IEEE Applied Power Electronics Conference on June 14-17, 2021

Source: NC State University Libraries
Added: September 9, 2021

2021 conference paper

Optimized AC/DC Dual Active Bridge Converter using Monolithic SiC Bidirectional FET (BiDFET) for PV Applications

Shah, S. S., Bhattacharya, S., Kanale, A., Cheng, T.-H., Mehrotra, U., Agarwal, A., … Hopkins, D. C. (2021, October 10). Presented at the IEEE Energy Conversion Congress and Exposition, Vancouver, Canada.

By: S. Shah, S. Bhattacharya, A. Kanale, T. Cheng, U. Mehrotra, A. Agarwal, B. Baliga, D. Hopkins

Event: IEEE Energy Conversion Congress and Exposition at Vancouver, Canada on October 10-14, 2021

Source: NC State University Libraries
Added: September 9, 2021

2021 conference paper

Accessible & Adaptable Approach for Calculating the Thermal Resistance of a Power Package using ParaPower

Maru, K., & Hopkins, D. C. (2021, March 17). Accessible & Adaptable Approach for Calculating the Thermal Resistance of a Power Package using ParaPower. Presented at the FREEDM System Center Annual Research Symposium, Raleigh, NC.

By: K. Maru & D. Hopkins

Event: FREEDM System Center Annual Research Symposium at Raleigh, NC on March 17-18, 2021

Source: NC State University Libraries
Added: September 9, 2021

2021 conference paper

E-Field Reduction Techniques in HV Multi-layered Modules Using New Capacitive Modelling Method

Sinha, S. S., & Hopkins, D. C. (2021, March 17). Presented at the FREEDM System Center Annual Research Symposium, Raleigh, NC.

By: S. Sinha & D. Hopkins

Event: FREEDM System Center Annual Research Symposium at Raleigh, NC on March 17-18, 2021

Source: NC State University Libraries
Added: September 9, 2021

2021 conference paper

Scalable Cascaded SuperCascode High Voltage Power Switch

Mehrotra, U., & Hopkins, D. C. (2021, March 17). Presented at the FREEDM System Center Annual Research Symposium, Raleigh, NC.

By: U. Mehrotra & D. Hopkins

Event: FREEDM System Center Annual Research Symposium at Raleigh, NC on March 17-18, 2021

Source: NC State University Libraries
Added: September 9, 2021

2021 conference paper

A 40kV/mm Organic Substrate for Low Voltage Power SiP and >10kV Power Modules

Hopkins, D. C., Yu, W., Mehrotra, U., Cheng, T.-H., Sinha, S. S., Maru, K., & Mescia, N. (2021, March 17). A 40kV/mm Organic Substrate for Low Voltage Power SiP and >10kV Power Modules. Presented at the FREEDM System Center Annual Research Symposium, Raleigh, NC.

By: D. Hopkins, W. Yu, U. Mehrotra, T. Cheng, S. Sinha, K. Maru, N. Mescia

Event: FREEDM System Center Annual Research Symposium at Raleigh, NC on March 17-18, 2021

Source: NC State University Libraries
Added: September 9, 2021

2021 conference paper

A New Cascaded SuperCascode High Voltage Power Switch

2021 IEEE Applied Power Electronics Conference and Exposition (APEC). Presented at the 2021 IEEE Applied Power Electronics Conference and Exposition (APEC), Phoenix, AZ.

By: U. Mehrotra & D. Hopkins

Event: 2021 IEEE Applied Power Electronics Conference and Exposition (APEC) at Phoenix, AZ on June 14-17, 2021

Sources: Crossref, ORCID
Added: September 5, 2021

2021 journal article

Bidirectional Solid-State Circuit Breaker using Super Cascode for MV SST and Energy Storage Systems

IEEE Journal of Emerging and Selected Topics in Power Electronics, 1–1.

By: U. Mehrotra, B. Ballard & D. Hopkins

Sources: Crossref, ORCID
Added: September 5, 2021

2021 conference paper

Switching Characteristics of a 1.2 kV, 50 mΩ SiC Monolithic Bidirectional Field Effect Transistor (BiDFET) with Integrated JBS Diodes

2021 IEEE Applied Power Electronics Conference and Exposition (APEC). Presented at the 2021 IEEE Applied Power Electronics Conference and Exposition (APEC).

By: A. Kanale, T. Cheng, S. Shah, K. Han, A. Agarwal, B. Baliga, D. Hopkins, S. Bhattacharya

Event: 2021 IEEE Applied Power Electronics Conference and Exposition (APEC)

Sources: Crossref, ORCID
Added: September 4, 2021

2021 conference paper

Design and Characterization of 3.3 kV-15 kV rated DBC Power Modules for Developmental Testing of WBG devices

2021 IEEE Applied Power Electronics Conference and Exposition (APEC). Presented at the 2021 IEEE Applied Power Electronics Conference and Exposition (APEC).

By: U. Mehrotra, A. Morgan & D. Hopkins

Event: 2021 IEEE Applied Power Electronics Conference and Exposition (APEC)

Sources: Crossref, ORCID
Added: September 4, 2021

2021 article

A Soft Variable-Area Electrical-Double-Layer Energy Harvester

Vallem, V., Roosa, E., Ledinh, T., Jung, W., Kim, T.-il, Rashid-Nadimi, S., … Dickey, M. D. (2021, August 31). ADVANCED MATERIALS, Vol. 8.

By: V. Vallem, E. Roosa, T. Ledinh, W. Jung, T. Kim, S. Rashid-Nadimi, A. Kiani, M. Dickey

Sources: ORCID, Web Of Science
Added: September 1, 2021

2021 article

Gallium Liquid Metal: The Devil's Elixir

ANNUAL REVIEW OF MATERIALS RESEARCH, VOL 51, 2021.

By: S. Tang, C. Tabor, K. Kalantar-Zadeh & M. Dickey

Sources: Web Of Science, ORCID
Added: August 30, 2021

2021 journal article

Processing of tungsten through electron beam melting *

JOURNAL OF NUCLEAR MATERIALS, 11.

By: E. Ellis, M. Sprayberry, C. Ledford, J. Hankwitz, M. Kirka, C. Rock, T. Horn, Y. Katoh, R. Dehoff

Sources: Web Of Science, ORCID
Added: August 30, 2021

2021 article

A Microvascular-Based Multifunctional and Reconfigurable Metamaterial

Devi, U., Pejman, R., Phillips, Z. J., Zhang, P., Soghrati, S., Nakshatrala, K. B., … Patrick, J. F. (2021, August 16). ADVANCED MATERIALS TECHNOLOGIES.

By: U. Devi, R. Pejman, Z. Phillips, P. Zhang, S. Soghrati, K. Nakshatrala, A. Najafi, K. Schab, J. Patrick

Source: Web Of Science
Added: August 23, 2021

2021 journal article

3-D Prismatic Packaging Methodologies for Wide Band Gap Power Electronics Modules

IEEE TRANSACTIONS ON POWER ELECTRONICS, 11.

Sources: Web Of Science, ORCID
Added: August 16, 2021