Materials Science & Engineering

Microstructural evolution and thermal stability of Fe–Zr metastable alloys developed by mechanical alloying followed by annealing

Philosophical Magazine, 96(25), 2649–2670.

A Study of Surfaces, Interfaces and Point Defect Control in III-Nitrides

Multidimensional Analysis of Nanoscale Phase Separation in Complex Materials Systems

Microscopy and Microanalysis, 22(S3), 282–283.

Ultralight Materials: Ultralight Interconnected Metal Oxide Nanotube Networks (Small 18/2016)

Small, 12(18), 2387–2387.

Probing the subtleties of atomic distortions through accurate STEM imaging and density functional theory

Microscopy and Microanalysis, 22(S3), 1400–1401.

Feasibility of formation of nanocrystalline Fe-Cr-Y alloys: Mechanical properties and thermal stability

Materials Characterization, 114, 43–53.

Observing Misfit Dislocation Interactions Across Thin Film Oxide Heterostructures

Microscopy and Microanalysis, 22(S3), 1506–1507.

Effects of Microstructure and Processing Methods on Creep Behavior of AZ91 Magnesium Alloy

Journal of Materials Engineering and Performance, 25(9), 3697–3709.

Macromol. Rapid Commun. 22/2016

Macromolecular Rapid Communications, 37(22), 1785–1785.

A high-throughput technique for determining grain boundary character non-destructively in microstructures with through-thickness grains

Npj Computational Materials, 2(1).

Photodetectors: Inorganic UV-Visible-SWIR Broadband Photodetector Based on Monodisperse PbS Nanocrystals (Small 10/2016)

Small, 12(10), 1246–1246.

Perovskite Solar Cells on Corrugated Substrates with Enhanced Efficiency

Small, 12(46), 6346–6352.

Substrate Effects on Growth of MoS2 Film by Laser Physical Vapor Deposition on Sapphire, Si and Graphene (on Cu)

Journal of Electronic Materials, 46(2), 1010–1021.

Thermal and Electrical Characterizations of Ultra-Thin Flexible 3YSZ Ceramic for Electronic Packaging Applications

International Symposium on Microelectronics, 2016(1), 000391–000396.

Thermal conductivity and interface thermal conductance of thin films in Li ion batteries

Journal of Power Sources, 327, 565–572.

Thermal conductivity and interface thermal conductance of titanium silicide films on Si

IEEE Transactions on Electron Devices, 63(1), 432–438.

Adhesion, Modulus and Thermal Conductivity of Porous Epoxy Film on Silicon Wafers

Journal of Electronic Materials, 45(11), 5877–5884.

Thermal Conductivity Changes in Titanium-Graphene Composite upon Annealing

Metallurgical and Materials Transactions A: Physical Metallurgy and Materials Science, 47(2), 907–915.

Effect of intermetallic compounds on the thermal conductivity of Ti-Cu composites

Journal of Vacuum Science and Technology A: Vacuum, Surfaces and Films, 34(2).

Electrical and thermal conductivity of indium-graphene and copper-graphene composites

In Graphene Science Handbook: Electrical and Optical Properties (pp. 639–653). http://www.scopus.com/inward/record.url?eid=2-s2.0-85052463875&partnerID=MN8TOARS