Center for Additive Manufacturing and Logistics

College of Engineering

Works Published in 2019

Sorted by most recent date added to the index first, which may not be the same as publication date order.

2019 conference paper

Coordinating Capacity Negotiations in Semiconductor Manufacturing

Proceedings of the IEEE Conference on Automation Science and Engineering. Presented at the CASE 2019 - International Conference on Automation Science and Engineering, Vancouver, British Columbia, Canada.

By: A. Bansal, R. Uzsoy & K. Kempf

Event: CASE 2019 - International Conference on Automation Science and Engineering at Vancouver, British Columbia, Canada

Source: NC State University Libraries
Added: February 26, 2022

2019 speech

Impact of Part Scheduling Policy on Additive Manufacturing Production System Performance

Kapadia, M. S., Starly, B., Thomas, A., Uzsoy, R., & Warsing, D. (2019, May). Presented at the Institute of Industrial and Systems Engineering Research Conference, Orlando, FL.

By: M. Kapadia, B. Starly, A. Thomas, R. Uzsoy & D. Warsing

Event: Institute of Industrial and Systems Engineering Research Conference at Orlando, FL

Source: NC State University Libraries
Added: February 26, 2022

2019 speech

Simulation Optimization For Planning Product Transitions In Semiconductor Manufacturing Facilities

Manda, A. B., & Uzsoy, R. (2019, May). Presented at the Institute of Industrial and Systems Engineering Research Conference, Orlando, FL.

By: A. Manda & R. Uzsoy

Event: Institute of Industrial and Systems Engineering Research Conference at Orlando, FL

Source: NC State University Libraries
Added: February 26, 2022

2019 speech

Conic Reformulation of Production Planning Models with Clearing Functions

Gopalswamy, K., & Uzsoy, R. (2019, May). Presented at the Institute of Industrial and Systems Engineering Research Conference, Orlando, FL.

By: K. Gopalswamy & R. Uzsoy

Event: Institute of Industrial and Systems Engineering Research Conference at Orlando, FL

Source: NC State University Libraries
Added: February 26, 2022

2019 article proceedings

Optimzing Engineering and Production Lots During Product Transitions in Semiconductor Manufacturing

Presented at the 2019 Winter Simulation Conference (WSC).

By: A. Manda & R. Uzsoy

Event: 2019 Winter Simulation Conference (WSC)

Sources: Crossref, ORCID
Added: February 26, 2022

2019 article proceedings

Evaluating Mixed Integer Programming Models for Solving Stochastic Inventory Problems

Presented at the 2019 Winter Simulation Conference (WSC).

By: B. Bluemink, A. de Kok, B. Srinivasan & R. Uzsoy

Event: 2019 Winter Simulation Conference (WSC)

Sources: Crossref, ORCID
Added: February 26, 2022

2019 article proceedings

A Robust Optimization Approach for Production Planning Under Exogenous Planned Lead Times

Presented at the 2019 Winter Simulation Conference (WSC).

By: E. Albey, I. Yanikoglu & R. Uzsoy

Event: 2019 Winter Simulation Conference (WSC)

Sources: Crossref, ORCID
Added: February 25, 2022

2019 article

Penalized matrix regression for two-dimensional variable selection

ArXiv.

By: C. Jeong & X. Fang

Source: ORCID
Added: February 24, 2022

2019 conference paper

Bi–Directional Solid-State Circuit Breaker for MV Applications Based on SuperCascode Switching

Ballard, B., Mehrotra, U., & Hopkins, D. C. (2019, February 12). Presented at the Power America Annual Meeting, Raleigh, NC.

By: B. Ballard, U. Mehrotra & D. Hopkins

Event: Power America Annual Meeting at Raleigh, NC on February 12-14, 2019

Source: NC State University Libraries
Added: September 9, 2021

2019 conference paper

Trends in Power Electronics Packaging

Hopkins, D. C. (2019, April 10). Tutorial presented at the FREEDM Systems Center Annual Research Symposium, Raleigh, NC.

Event: FREEDM Systems Center Annual Research Symposium at Raleigh, NC on April 10-12, 2019

Source: NC State University Libraries
Added: September 9, 2021

2019 conference paper

New Dynamic Power MOSFET Model to Determine Maximum Device Operating Frequency

Morgan, A., Kanale, A., Han, K., Baliga, J., & Hopkins, D. C. (2019, April 10). Presented at the FREEDM Systems Center Annual Research Symposium, Raleigh, NC.

By: A. Morgan, A. Kanale, K. Han, J. Baliga & D. Hopkins

Event: FREEDM Systems Center Annual Research Symposium at Raleigh, NC on April 10-12, 2019

Source: NC State University Libraries
Added: September 9, 2021

2019 conference paper

High Frequency Self-Oscillating WBG-based Power Conversion

Morgan, A., Gao, B., & Hopkins, D. C. (2019, April 10). Presented at the FREEDM Systems Center Annual Research Symposium, Raleigh, NC.

By: A. Morgan, B. Gao & D. Hopkins

Event: FREEDM Systems Center Annual Research Symposium at Raleigh, NC on April 10-12, 2019

Source: NC State University Libraries
Added: September 9, 2021

2019 conference paper

ERCD Power Stage Characterization for MV SSCB Application

Sinha, S. S., Ballard, B., & Hopkins, D. C. (2019, August 6). Presented at the Power America Summer Workshop, Raleigh, NC.

By: S. Sinha, B. Ballard & D. Hopkins

Event: Power America Summer Workshop at Raleigh, NC on August 6-8, 2019

Source: NC State University Libraries
Added: September 9, 2021

2019 conference paper

Development of a High Frequency LLC Resonant Converter for Investigation of MLCCs for EV applications

Guven, M., Gao, B., & Hopkins, D. C. (2019, August 6). Presented at the Power America Summer Workshop, Raleigh, NC.

By: M. Guven, B. Gao & D. Hopkins

Event: Power America Summer Workshop at Raleigh, NC on August 6-8, 2019

Source: NC State University Libraries
Added: September 9, 2021

2019 conference paper

WBG Solid State Circuit Protection using 10kV/200 A Super Cascode power module

Mehrotra, U., & Hopkins, D. (2019, August 6). Presented at the Power America Summer Workshop 2019, Raleigh, NC.

By: U. Mehrotra & D. Hopkins

Event: Power America Summer Workshop 2019 at Raleigh, NC on August 6-8, 2019

Source: NC State University Libraries
Added: September 9, 2021

2019 conference paper

Opportunities in Power Applications using Epoxy Resin Composite Dielectrics

Hopkins, D., & Ballard, B. (2019, August 6). Presented at the Power America Summer Workshop 2019, Raleigh, NC.

By: D. Hopkins & B. Ballard

Event: Power America Summer Workshop 2019 at Raleigh, NC on August 6-8, 2019

Source: NC State University Libraries
Added: September 9, 2021

2019 conference paper

Advances in Organic Substrate Approaches for High Voltage Power Electronics Packaging

Cheng, T.-H., Gao, B., Boteler, L., & Hopkins, D. (2019, November 13). Presented at the PCB Carolina, Raleigh, NC.

By: T. Cheng, B. Gao, L. Boteler & D. Hopkins

Event: PCB Carolina at Raleigh, NC on November 13, 2019

Source: NC State University Libraries
Added: September 9, 2021

2019 conference paper

Power Packaging Assembly Challenges

Hopkins, D. C. (2019, March 27). Invited keynote presented at the A.R.E.A. Consortium Meeting Universal Instruments, Binghamton, NY.

Event: A.R.E.A. Consortium Meeting Universal Instruments at Binghamton, NY on March 27-29, 2019

Source: NC State University Libraries
Added: September 9, 2021

2019 conference paper

1.2 kV, 10 A, 4H-SiC Bi-Directional Field Effect Transistor (BiDFET) with Low On-State Voltage Drop

Kanale, A., Cheng, T.-H., Hanl, K., Baliga, B. J., Bhattacharya, S., & Hopkins, D. (2019, September 29). Presented at the International Conference on Silicon Carbide and Related Materials, Kyoto, Japan.

By: A. Kanale, T. Cheng, K. Hanl, B. Baliga, S. Bhattacharya & D. Hopkins

Event: International Conference on Silicon Carbide and Related Materials at Kyoto, Japan on September 29 - October 4, 2019

Source: NC State University Libraries
Added: September 9, 2021

2019 conference paper

Characterization of a Topside Cooled Epoxy-Resin Composite Dielectric (ERCD) Package for Bi-Directional Power Switch

Cheng, T.-H., Gao, B., Nishiguchi, K., & Hopkins, D. (2019, October 7). Presented at the ASME International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems (InterPACK), Anaheim, CA.

By: T. Cheng, B. Gao, K. Nishiguchi & D. Hopkins

Event: ASME International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems (InterPACK) at Anaheim, CA on October 7-9, 2019

Source: NC State University Libraries
Added: September 9, 2021