Center for Additive Manufacturing and Logistics

Design and Development of Biopolymers for Additive Manufacturing

Peer-Reviewed Proceedings of the 2018 Industrial and Systems Engineering, 330–335.

Production Planning Models with Chance Constraints and Advance Demand Information

Ziarnetzky, T., Monch, L., & Uzsoy, R. (2018, May). Presented at the IISE Annual Conference, Orlando, FL.

Coordinating Capacity Negotiations In Semiconductor Industry

Bansal, A., Uzsoy, R., & Kempf, K. G. (2018, November). Presented at the INFORMS National Meeting, Phoenix, AZ.

Modeling for the Equitable and Effective Distribution of Food Donations Under Stochastic Capacities

Sengul Orgut, I., Ivy, J. S., & Uzsoy, R. (2018, November). Presented at the INFORMS National Meeting, Phoenix, AZ.

Robust Optimization Approaches for the Equitable and Effective Distribution of Donated Food

Sengul Orgut, I., Ivy, J. S., Uzsoy, R., & Hale, C. (2018, November). Presented at the INFORMS National Meeting, Phoenix, AZ.

Problem Reduction Approaches for Production Planning Using Clearing Functions

Presented at the 2018 IEEE 14th International Conference on Automation Science and Engineering (CASE).

AN EXPLORATORY COMPARISON OF CLEARING FUNCTION AND DATA-DRIVEN PRODUCTION PLANNING MODELS

Presented at the 2018 Winter Simulation Conference (WSC).

SIMULATION OPTIMIZATION FOR PLANNING PRODUCT TRANSITIONS IN SEMICONDUCTOR MANUFACTURING FACILITIES

Presented at the 2018 Winter Simulation Conference (WSC).

A Review of Product Ramping Models in Semiconductor Manufacturing

Manda, A. B., & Uzsoy, R. (2018, November). Presented at the INFORMS National Meeting, Phoenix, AZ.

Planning Releases During Product Transitions in Semiconductor Manufacturing

Manda, A. B., & Uzsoy, R. (2018, November). Presented at the INFORMS National Meeting, Phoenix, AZ.

Conic Reformulations of Production Planning Problems with Clearing Functions

Gopalswamy, K., & Uzsoy, R. (2018, November). Presented at the INFORMS National Meeting, Phoenix, AZ.

Production Planning and Engineering Process Improvement

Communications in Applied Analysis, 22(4), 583–596.

Editorial 2017 Best Paper Award

IEEE Transactions on Semiconductor Manufacturing, 31(3), 325–325.

Real-Time Predictive Analytics Using Degradation Image Data

Proceedings - Annual Reliability and Maintainability Symposium, 2018-January.

Heterogeneous Integration Roadmap Update-integrated power electronics (IPE)

Hopkins, D. C. (2018, June 25). Presented at the International Symposium on 3D Power Electronics Integration and Manufacturing, College Park, MD.

Comparing Power Packaging Through A Thermal Resistance Circle Based on Finite Element Analysis

Chen, T., & Hopkins, D. C. (2018, February 6). Presented at the PowerAmerica Annual Meeting, Raleigh, NC.

6.5kV, 100A, 175kHz Super Cascode Power Module (SCPM)

Gao, B., Morgan, A., Xu, Y., Zhao, X., & Hopkins, D. C. (2018, February 6). Presented at the PowerAmerica Annual Meeting, Raleigh, NC.

Scalable MV/HV Super Cascode Power Module

Gao, B., Morgan, A., & Hopkins, D. C. (2018, June 7). Presented at the FREEDM Systems Center Annual Meeting, Raleigh, NC.

Development of De-encapsulation Process for WBG Semiconductor Packaging Rework and Failure Analysis

Golding, C., & Hopkins, D. C. (2018, June 7). Presented at the FREEDM Systems Center Annual Meeting, Raleigh, NC.

Parasitic Integration for 500kHz ZVS DC-DC Converter Using New Polymer Material in IMS Module

Guven, M., & Hopkins, D. C. (2018, June 7). Presented at the FREEDM Systems Center Annual Meeting, Raleigh, NC.