Center for Additive Manufacturing and Logistics

Works Published in 2007

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Displaying works 1 - 20 of 36 in total

Sorted by most recent date added to the index first, which may not be the same as publication date order.

2007 conference paper

Advanced Power Packaging for High Reliability and Higher Temperatures

40th International Symposium on Microelectronics. Presented at the 40th International Symposium on Microelectronics, San Jose, CA.

By: D. Hopkins

Event: 40th International Symposium on Microelectronics at San Jose, CA on November 10-15, 2007

Source: NC State University Libraries
Added: July 22, 2023

2007 conference paper

Introduction to Power Packaging Techniques

22nd Annual IEEE Conference on Applied Power Electronics Conference and Exposition (APEC). Presented at the 22nd Annual IEEE Conference on Applied Power Electronics Conference and Exposition (APEC), Anaheim, CA.

By: D. Hopkins

Event: 22nd Annual IEEE Conference on Applied Power Electronics Conference and Exposition (APEC) at Anaheim, CA on February 25 - March 1, 2007

Source: NC State University Libraries
Added: July 22, 2023

2007 conference paper

Process monitoring of the abrasive machining process when wood is used

Presented at the Industrial Engineering Research Conference. Institute of Industrial Engineers, Nashville, TN.

By: D. Saloni, R. Lemaster & A. Cardenas

Event: Industrial Engineering Research Conference. Institute of Industrial Engineers at Nashville, TN

Source: NC State University Libraries
Added: May 27, 2022

2007 conference paper

Simulation model design as a tool for improving abrasive machining process

Presented at the Institute of Industrial Engineers Solutions Conference. Institute of Industrial Engineers, Nashville, TN.

By: N. Barreto, D. Saloni, A. Cardenas, H. Gasparin & R. Lemaster

Event: Institute of Industrial Engineers Solutions Conference. Institute of Industrial Engineers at Nashville, TN

Source: NC State University Libraries
Added: May 27, 2022

2007 conference paper

Design and development of a process monitoring and control system for abrasive machining processes

Presented at the International Wood machining Seminar, Vancouver, CA.

By: D. Saloni & R. Lemaster

Event: International Wood machining Seminar at Vancouver, CA

Source: NC State University Libraries
Added: May 27, 2022

2007 conference paper

Multiproduct Network Design Model with Lead Time and Safety Stock Considerations

Sourirajan, K., Ozsen, L., & Uzsoy, R. (2007, July). Presented at the INFORMS International Meeting, Rio Mar, Puerto Rico.

By: K. Sourirajan, L. Ozsen & R. Uzsoy

Event: INFORMS International Meeting at Rio Mar, Puerto Rico

Source: NC State University Libraries
Added: May 1, 2022

2007 conference paper

Lead Time Based Heuristics for Integrated Production and Safety Stock Planning

Orcun, S., Uzsoy, R., & Kempf, K. G. (2007, July). Presented at the INFORMS International Meeting, Rio Mar, Puerto Rico.

By: S. Orcun, R. Uzsoy & K. Kempf

Event: INFORMS International Meeting at Rio Mar, Puerto Rico

Source: NC State University Libraries
Added: May 1, 2022

2007 article proceedings

Determining safety stocks in the presence of workload-dependent lead times

Presented at the 2007 Winter Simulation Conference.

By: S. Orcun*, S. Cetinkaya* & R. Uzsoy*

Event: 2007 Winter Simulation Conference

TL;DR: It is shown that even when extensive historical data is used, conventional approaches to setting safety stocks fail to provide the desired service level when lead times are load-dependent, and suggested directions for future research are suggested. (via Semantic Scholar)
Sources: Crossref, ORCID
Added: March 6, 2022

2007 conference paper

The effect of layer thickness variation on the thermo-mechanical properties of direct aluminum bonded substrates on AlSiC

Proceedings of the 2007 International Symposium on Microelectronics : November 11-15, 2007, San Jose Convention Center, san Jose, California, USA. Presented at the 40th International Microelectronics and Packaging Society (IMAPS) International Symposium on Microelectronics, San Jose, CA.

By: T. McKay, D. Hopkins & C. Basaran

Event: 40th International Microelectronics and Packaging Society (IMAPS) International Symposium on Microelectronics at San Jose, CA on November 11-15, 2007

Source: NC State University Libraries
Added: October 28, 2021

2007 conference paper

Solder Interconnect Electromigration Due to Time Varying Current Stressing

Proceedings of the 2007 International Symposium on Microelectronics : November 11-15, 2007, San Jose Convention Center, San Jose, California, USA, 10. Washington, D.C.: IMAPS.

By: K. Enser, D. Hopkins & C. Basaran

Event: 40th International Microelectronics and Packaging Society (IMAPS) International Symposium on Microelectronics at San Jose, CA on November 11-15, 2007

Source: NC State University Libraries
Added: October 28, 2021

2007 conference paper

A Review of Electromigration Under Time Varying Current Stressing

Enser, K. E., Hopkins, D. C., & Basaran, C. (2007, April 19). Presented at the Society of Automotive Engineers (SAE) International Symposium, Toronto, Canada.

By: K. Enser, D. Hopkins & C. Basaran

Event: Society of Automotive Engineers (SAE) International Symposium at Toronto, Canada on April 19, 2007

Source: NC State University Libraries
Added: October 23, 2021

2007 conference paper

IMC Effects in Solder from High Thermal Gradients Management

Presented at the International Electronics Packaging Symposium, Niskayuna, NY.

By: M. Abdulhamid, D. Hopkins & C. Basaran

Event: International Electronics Packaging Symposium at Niskayuna, NY on July 31 - August 1, 2007

Source: NC State University Libraries
Added: October 23, 2021

2007 conference paper

Harsh Environment Thermal Management Using Aluminum-Based Packaging

Presented at the International Electronics Packaging Symposium, Niskayuna, NY.

By: T. McKay, D. Hopkins, C. Basaran & M. Abdulhamid

Event: International Electronics Packaging Symposium at Niskayuna, NY on July 31 - August 1, 2007

Source: NC State University Libraries
Added: October 23, 2021

2007 chapter

Packaging and Smart Power Systems

In M. H. Rashid (Ed.), Power Electronics Handbook (2nd ed., pp. 1147–1158).

By: D. Hopkins*

Ed(s): M. Rashid

UN Sustainable Development Goal Categories
7. Affordable and Clean Energy (OpenAlex)
Sources: Crossref, ORCID
Added: September 5, 2021

2007 conference paper

Effects of paper manufacturing factors on inkjet print quality and lightfastness

NIP & Digital Fabrication Conference, 6, 749–754. Springfield, Virginia: Society for Imaging Science and Technology.

By: L. Pal, S. Agate & P. Fleming

Event: 2007 International Conference on Digital Printing Technologies at Anchorage, Alaska on September 16-21, 2007

Source: NC State University Libraries
Added: January 17, 2021

2007 journal article

Incorporating manufacturing lead times in joint production-marketing models: A review and some future directions

Annals of Operations Research, 161(1), 171–188.

By: A. Upasani* & R. Uzsoy n

author keywords: production/marketing interface; dynamic price and lead time quotation; load dependent lead time
TL;DR: A number of directions for future research are suggested that take advantage of recent developments in production planning models, as well as explicit modeling of feedback loops governing key parameters, which suggest a broader view of the problem. (via Semantic Scholar)
UN Sustainable Development Goal Categories
Sources: Crossref, ORCID
Added: January 5, 2021

2007 journal article

Formal approach to include a human material handler in a computer-integrated manufacturing (CIM) system

International Journal of Production Research, 45(9), 1953–1971.

By: B. Altuntas*, R. Wysk* & L. Rothrock*

author keywords: shop-floor control; supervisory control; human computer interaction
TL;DR: The human in the automatic manufacturing system addressed here serves primarily as a material handler and material transporter, providing almost unlimited possibilities regarding the accessibility of product flow from any system resource to any other system resource—a major constraint in many operational systems. (via Semantic Scholar)
Source: Crossref
Added: August 28, 2020

2007 journal article

Simulation-based planning and control: From shop floor to top floor

Journal of Manufacturing Systems, 26(2), 85–98.

By: S. Lee*, Y. Son* & R. Wysk*

TL;DR: This paper illustrates how simulation-based shop-floor planning and control can be extended to enterprise-level activities (top floor) by using a distributed computing platform using Web services technology to integrate heterogeneous simulations and systems in a distributed top-floor control environment. (via Semantic Scholar)
Source: Crossref
Added: August 28, 2020

2007 conference paper

Public logistics network protocol design and implementation

IIE Annual Conference and Expo 2007 - Industrial Engineering's Critical Role in a Flat World - Conference Proceedings, 1593–1598. http://www.scopus.com/inward/record.url?eid=2-s2.0-44949150426&partnerID=MN8TOARS

By: X. Ling, M. Kay & J. Telford

Contributors: X. Ling, M. Kay & J. Telford

Source: ORCID
Added: April 29, 2020

2007 conference paper

A comparison of meta-heuristics for large scale facility location problems with economies of scale

IIE Annual Conference and Expo 2007 - Industrial Engineering's Critical Role in a Flat World - Conference Proceedings, 1410–1415. http://www.scopus.com/inward/record.url?eid=2-s2.0-44949149427&partnerID=MN8TOARS

By: M. Bucci, M. Kay & D. Warsing

Contributors: M. Bucci, M. Kay & D. Warsing

Source: ORCID
Added: April 29, 2020

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