College of Engineering
Displaying works 1 - 20 of 36 in total
Sorted by most recent date added to the index first, which may not be the same as publication date order.
2007 conference paper
Advanced Power Packaging for High Reliability and Higher Temperatures
40th International Symposium on Microelectronics. Presented at the 40th International Symposium on Microelectronics, San Jose, CA.
Event: 40th International Symposium on Microelectronics at San Jose, CA on November 10-15, 2007
2007 conference paper
Introduction to Power Packaging Techniques
22nd Annual IEEE Conference on Applied Power Electronics Conference and Exposition (APEC). Presented at the 22nd Annual IEEE Conference on Applied Power Electronics Conference and Exposition (APEC), Anaheim, CA.
Event: 22nd Annual IEEE Conference on Applied Power Electronics Conference and Exposition (APEC) at Anaheim, CA on February 25 - March 1, 2007
2007 conference paper
Process monitoring of the abrasive machining process when wood is used
Presented at the Industrial Engineering Research Conference. Institute of Industrial Engineers, Nashville, TN.
Event: Industrial Engineering Research Conference. Institute of Industrial Engineers at Nashville, TN
2007 conference paper
Simulation model design as a tool for improving abrasive machining process
Presented at the Institute of Industrial Engineers Solutions Conference. Institute of Industrial Engineers, Nashville, TN.
Event: Institute of Industrial Engineers Solutions Conference. Institute of Industrial Engineers at Nashville, TN
2007 conference paper
Design and development of a process monitoring and control system for abrasive machining processes
Presented at the International Wood machining Seminar, Vancouver, CA.
Event: International Wood machining Seminar at Vancouver, CA
2007 conference paper
Multiproduct Network Design Model with Lead Time and Safety Stock Considerations
Sourirajan, K., Ozsen, L., & Uzsoy, R. (2007, July). Presented at the INFORMS International Meeting, Rio Mar, Puerto Rico.
Event: INFORMS International Meeting at Rio Mar, Puerto Rico
2007 conference paper
Lead Time Based Heuristics for Integrated Production and Safety Stock Planning
Orcun, S., Uzsoy, R., & Kempf, K. G. (2007, July). Presented at the INFORMS International Meeting, Rio Mar, Puerto Rico.
Event: INFORMS International Meeting at Rio Mar, Puerto Rico
2007 article proceedings
Determining safety stocks in the presence of workload-dependent lead times
Presented at the 2007 Winter Simulation Conference.
Event: 2007 Winter Simulation Conference
2007 conference paper
The effect of layer thickness variation on the thermo-mechanical properties of direct aluminum bonded substrates on AlSiC
Proceedings of the 2007 International Symposium on Microelectronics : November 11-15, 2007, San Jose Convention Center, san Jose, California, USA. Presented at the 40th International Microelectronics and Packaging Society (IMAPS) International Symposium on Microelectronics, San Jose, CA.
Event: 40th International Microelectronics and Packaging Society (IMAPS) International Symposium on Microelectronics at San Jose, CA on November 11-15, 2007
2007 conference paper
Solder Interconnect Electromigration Due to Time Varying Current Stressing
Proceedings of the 2007 International Symposium on Microelectronics : November 11-15, 2007, San Jose Convention Center, San Jose, California, USA, 10. Washington, D.C.: IMAPS.
Event: 40th International Microelectronics and Packaging Society (IMAPS) International Symposium on Microelectronics at San Jose, CA on November 11-15, 2007
2007 conference paper
A Review of Electromigration Under Time Varying Current Stressing
Enser, K. E., Hopkins, D. C., & Basaran, C. (2007, April 19). Presented at the Society of Automotive Engineers (SAE) International Symposium, Toronto, Canada.
Event: Society of Automotive Engineers (SAE) International Symposium at Toronto, Canada on April 19, 2007
2007 conference paper
IMC Effects in Solder from High Thermal Gradients Management
Presented at the International Electronics Packaging Symposium, Niskayuna, NY.
Event: International Electronics Packaging Symposium at Niskayuna, NY on July 31 - August 1, 2007
2007 conference paper
Harsh Environment Thermal Management Using Aluminum-Based Packaging
Presented at the International Electronics Packaging Symposium, Niskayuna, NY.
Event: International Electronics Packaging Symposium at Niskayuna, NY on July 31 - August 1, 2007
2007 chapter
Packaging and Smart Power Systems
In M. H. Rashid (Ed.), Power Electronics Handbook (2nd ed., pp. 1147–1158).
Ed(s): M. Rashid
2007 conference paper
Effects of paper manufacturing factors on inkjet print quality and lightfastness
NIP & Digital Fabrication Conference, 6, 749–754. Springfield, Virginia: Society for Imaging Science and Technology.
Event: 2007 International Conference on Digital Printing Technologies at Anchorage, Alaska on September 16-21, 2007
2007 journal article
Incorporating manufacturing lead times in joint production-marketing models: A review and some future directions
Annals of Operations Research, 161(1), 171–188.
2007 journal article
Formal approach to include a human material handler in a computer-integrated manufacturing (CIM) system
International Journal of Production Research, 45(9), 1953–1971.
2007 journal article
Simulation-based planning and control: From shop floor to top floor
Journal of Manufacturing Systems, 26(2), 85–98.
2007 conference paper
Public logistics network protocol design and implementation
IIE Annual Conference and Expo 2007 - Industrial Engineering's Critical Role in a Flat World - Conference Proceedings, 1593–1598. http://www.scopus.com/inward/record.url?eid=2-s2.0-44949150426&partnerID=MN8TOARS
2007 conference paper
A comparison of meta-heuristics for large scale facility location problems with economies of scale
IIE Annual Conference and Expo 2007 - Industrial Engineering's Critical Role in a Flat World - Conference Proceedings, 1410–1415. http://www.scopus.com/inward/record.url?eid=2-s2.0-44949149427&partnerID=MN8TOARS