Electrical and Computer Engineering

Works Published in 2006

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Displaying works 121 - 140 of 305 in total

Sorted by most recent date added to the index first, which may not be the same as publication date order.

2006 conference paper

High-Frequency Characterization of Printed CPW Lines on Textiles using a Custom Test Fixture

2006 IEEE Workship on Signal Propagation on Interconnects. Presented at the 2006 IEEE Workship on Signal Propagation on Interconnects.

By: J. Wilson n, C. Merritt n, B. Karaguzel n, T. Kang n, H. Nagle n, E. Grant n, B. Pourdeyhemi n, P. Franzon n

co-author countries: United States of America 🇺🇸

Event: 2006 IEEE Workship on Signal Propagation on Interconnects

author keywords: wearable electronics; electronic textiles; RF and microwave testing; printed electronics; polymer thick film
Sources: Crossref, ORCID
Added: March 24, 2019

2006 conference paper

Considerations for Transmission Line Design on MCMs using AC Coupled Interconnect with Buried Solder Bumps

2006 IEEE Workship on Signal Propagation on Interconnects. Presented at the 2006 IEEE Workshop on Signal Propagation on Interconnects.

By: J. Wilson n, S. Mick n, J. Xu n, L. Luo n, E. Erickson n & P. Franzon n

co-author countries: United States of America 🇺🇸

Event: 2006 IEEE Workshop on Signal Propagation on Interconnects

author keywords: AC Coupled Interconnect; ACCI; buried solder bumps; transmission lines; routing; MCM; stripline
Sources: Crossref, ORCID
Added: March 24, 2019

2006 conference paper

Developing Improved IO Buffer Behavioral Modeling Methodology Based on IBIS

2006 IEEE Electrical Performane of Electronic Packaging. Presented at the 2006 IEEE Electrical Performane of Electronic Packaging.

By: A. Varma n, M. Steer n & P. Franzon n

co-author countries: United States of America 🇺🇸

Event: 2006 IEEE Electrical Performane of Electronic Packaging

Sources: Crossref, ORCID
Added: March 24, 2019

2006 conference paper

Fine Pitch Inductively Coupled Connectors for Multi-Gbps Pulse Signaling

2006 IEEE Electrical Performane of Electronic Packaging. Presented at the 2006 IEEE Electrical Performane of Electronic Packaging.

By: K. Chandrasekar n, J. Wilson n, E. Erickson n, Z. Feng n, J. Xu n, S. Mick n, P. Franzon n

co-author countries: United States of America 🇺🇸

Event: 2006 IEEE Electrical Performane of Electronic Packaging

Sources: Crossref, ORCID
Added: March 24, 2019

2006 conference paper

Controlled nanowire fabrication by PEDAL process

2006 1st International Conference on Nano-Networks and Workshops. Presented at the 2006 1st International Conference on Nano-Networks and Workshops.

By: S. Sonkusale n & P. Franzon n

co-author countries: United States of America 🇺🇸

Event: 2006 1st International Conference on Nano-Networks and Workshops

Sources: Crossref, ORCID
Added: March 24, 2019

2006 conference paper

Architecture for Low Power Large Vocabulary Speech Recognition

2006 IEEE International SOC Conference. Presented at the 2006 IEEE International SOC Conference.

By: D. Chandra n, U. Pazhayaveetil n & P. Franzon n

co-author countries: United States of America 🇺🇸

Event: 2006 IEEE International SOC Conference

Sources: Crossref, ORCID
Added: March 24, 2019

2006 conference paper

A 36Gb/s ACCI Multi-Channel Bus using a Fully Differential Pulse Receiver

IEEE Custom Integrated Circuits Conference 2006. Presented at the IEEE Custom Integrated Circuits Conference 2006.

By: L. Luo n, J. Wilson n, S. Mick n, J. Xu n, L. Zhang n, E. Erickson, P. Franzon

co-author countries: United States of America 🇺🇸

Event: IEEE Custom Integrated Circuits Conference 2006

Sources: Crossref, ORCID
Added: March 24, 2019

2006 conference paper

A 32Gb/s On-chip Bus with Driver Pre-emphasis Signaling

IEEE Custom Integrated Circuits Conference 2006. Presented at the Proceedings of the IEEE 2006 Custom Integrated Circuits Conference.

By: L. Zhang n, J. Wilson n, R. Bashirullah n, L. Luo n, J. Xu n & P. Franzon n

co-author countries: United States of America 🇺🇸

Event: Proceedings of the IEEE 2006 Custom Integrated Circuits Conference

Sources: Crossref, ORCID
Added: March 24, 2019

2006 conference paper

TCAM core design in 3D IC for low matchline capacitance and low power

In S. F. Al-Sarawi (Ed.), Smart Structures, Devices, and Systems III.

By: E. Oh n & P. Franzon n

co-author countries: United States of America 🇺🇸

Ed(s): S. Al-Sarawi

Event: Smart Materials, Nano- and Micro-Smart Systems

author keywords: TCAM (ternary content addressable memory); 3D1C (3-dimentional integrated circuits); integrated circuit interconnect; vertical interconnect; inter-tier via; 3D via; inatchline capacitance; interconnect capacitance; low power TCAM; CAM
Sources: Crossref, ORCID
Added: March 24, 2019

2006 conference paper

1E-3 Tomographic Photoacoustic Imaging Using Capacitive Micromachined Ultrasonic Transducer (CMUT) Technology

2006 IEEE Ultrasonics Symposium. Presented at the 2006 IEEE Ultrasonics Symposium.

By: S. Vaithilingam*, I. Wygant*, S. Sifferman*, X. Zhuang*, Y. Furukawa*, O. Oralkan*, S. Keren*, S. Gambhir*, B. Khuri-Yakub*

co-author countries: United States of America 🇺🇸

Event: 2006 IEEE Ultrasonics Symposium

Sources: Crossref, ORCID
Added: March 24, 2019

2006 conference paper

P2P-6 Trench-Isolated CMUT Arrays with a Supporting Frame

2006 IEEE Ultrasonics Symposium. Presented at the 2006 IEEE Ultrasonics Symposium.

By: X. Zhuang*, O. Oralkan*, B. Khuri-Yakub*, A. Ergun* & D. Lin*

co-author countries: United States of America 🇺🇸

Event: 2006 IEEE Ultrasonics Symposium

author keywords: CMUT; through-wafer trench-isolated interconnect; supporting frame
Sources: Crossref, ORCID
Added: March 24, 2019

2006 conference paper

Sensors on textile substrates for home-based healthcare monitoring

Proceedings of the 1st Conference on Distributed Diagnosis and Home Healthcare, 5–7.

By: T. Kang n, C. Merritt n, B. Karaguzel n, J. Wilson n, P. Franzon n, B. Pourdeyhimi n, E. Grant n, T. Nagle n

co-author countries: United States of America 🇺🇸

Event: 1st Transdisciplinary Conference on Distributed Diagnosis and Home Healthcare at Arlington, VA, USA on April 2-4, 2006

Sources: NC State University Libraries, ORCID, Crossref
Added: March 24, 2019

2006 conference paper

Synchronized phasor data based energy function analysis of power transfer paths

2006 IEEE Power Engineering Society General Meeting. Presented at the 2006 IEEE Power Engineering Society General Meeting.

By: J. Chow*, A. Chakrabortty*, M. Arcak*, B. Bhargava* & A. Salazar*

co-author countries: United States of America 🇺🇸

Event: 2006 IEEE Power Engineering Society General Meeting

Sources: Crossref, ORCID
Added: March 24, 2019

2006 report

Compressed Sensing Reconstruction via Belief Propagation

(Technical Report No. ECE-0601). Electrical and Computer Engineering Department, Rice University.

By: S. Sarvotham, D. Baron & R. Baraniuk

Source: NC State University Libraries
Added: March 24, 2019

2006 conference paper

Compressive Imaging for Video Representation and Coding

Proceedings of Picture Coding Symposium. Presented at the PCS.

By: M. Wakin, J. Laska, M. Duarte, D. Baron, S. Sarvotham, D. Takhar, K. Kelly, R. Baraniuk

Event: PCS

Source: NC State University Libraries
Added: March 24, 2019

2006 conference paper

Measurements vs. Bits: Compressed Sensing meets Information Theory

Proceedings of 44th Allerton Conference on Communication, Control, and Computing. Monticello, IL.

By: S. Sarvotham, D. Baron & R. Baraniuk

Source: NC State University Libraries
Added: March 23, 2019

2006 conference paper

Variable-Rate Universal Slepian-Wolf Coding with Feedback

Conference Record of the Thirty-Ninth Asilomar Conference onSignals, Systems and Computers, 2005. Presented at the Conference Record of the Thirty-Ninth Asilomar Conference onSignals, Systems and Computers, 2005.

By: S. Sarvotham*, D. Baron* & R. Baraniuk*

co-author countries: United States of America 🇺🇸

Event: Conference Record of the Thirty-Ninth Asilomar Conference onSignals, Systems and Computers, 2005.

Sources: Crossref, ORCID
Added: March 23, 2019

2006 conference paper

Random Filters for Compressive Sampling and Reconstruction

2006 IEEE International Conference on Acoustics Speed and Signal Processing Proceedings. Presented at the 2006 IEEE International Conference on Acoustics Speed and Signal Processing.

co-author countries: United States of America 🇺🇸

Event: 2006 IEEE International Conference on Acoustics Speed and Signal Processing

Sources: Crossref, ORCID
Added: March 23, 2019

2006 conference paper

Distributed Compressed Sensing of Jointly Sparse Signals

Conference Record of the Thirty-Ninth Asilomar Conference onSignals, Systems and Computers, 2005. Presented at the Conference Record of the Thirty-Ninth Asilomar Conference onSignals, Systems and Computers, 2005.

By: M. Duarte*, S. Sarvotham*, D. Baron*, M. Wakin* & R. Baraniuk*

co-author countries: United States of America 🇺🇸

Event: Conference Record of the Thirty-Ninth Asilomar Conference onSignals, Systems and Computers, 2005.

Sources: Crossref, ORCID
Added: March 23, 2019

2006 conference paper

A new compressive imaging camera architecture using optical-domain compression

In C. A. Bouman, E. L. Miller, & I. Pollak (Eds.), Computational Imaging IV.

By: D. Takhar*, J. Laska*, M. Wakin*, M. Duarte*, D. Baron*, S. Sarvotham*, K. Kelly*, R. Baraniuk*

co-author countries: United States of America 🇺🇸

Ed(s): C. Bouman, E. Miller & I. Pollak

Event: Electronic Imaging 2006

author keywords: Compressed Sensing; sparsity; incoherent projections; random matrices; linear programming; imaging; camera
Sources: Crossref, ORCID
Added: March 22, 2019

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