Electrical & Computer Engineering
College of Engineering
Works Published in 2004
Displaying works 1 - 20 of 243 in total
Sorted by most recent date added to the index first, which may not be the same as publication date order.
2004 report
Miniature RF components enabled by mesoscale rapid manufacturing.
Sandia National Lab.(SNL-NM), Albuquerque, NM (United States).
Source: ORCID
Added: February 5, 2023
2004 conference paper
Multi-Parameter Power Minimization of Synthesized Datapaths
IEEE Computer Society Annual Symposium on VLSI, 151–157.
Event: IEEE Computer Society Annual Symposium on VLSI at Lafayette, LA on February 19-20, 2004
Sources: Web Of Science, ORCID
Added: July 9, 2022
2004 conference paper
MM-wave transceivers using SiGe HBT technology
2004 Topical Meeting on Silicon Monolithic Integrated Circuits in RF Systems: Digest of Papers, 81–84. http://www.scopus.com/inward/record.url?eid=2-s2.0-20344405688&partnerID=MN8TOARS
Source: ORCID
Added: December 10, 2021
2004 conference paper
Deformation of Solder Joints Under Current Stressing: Experimental Measurement and Numerical Simulation
Presented at the 21st International Congress of Theoretical and Applied Mechanics, Warsaw, Poland.
Event: 21st International Congress of Theoretical and Applied Mechanics at Warsaw, Poland on August 15-21, 2004
Source: NC State University Libraries
Added: November 4, 2021
2004 conference paper
Damage mechanics of microelectronics solder joints under high current densities
2004 Proceedings. 54th Electronic Components and Technology Conference (IEEE Cat. No.04CH37546). Presented at the 2004 54th Electronic Components and Technology Conference, Las Vegas, NV.
Event: 2004 54th Electronic Components and Technology Conference at Las Vegas, NV on June 4, 2004
Sources: Crossref, ORCID
Added: September 5, 2021
2004 journal article
Pb phase coarsening in eutectic Pb/Sn flip chip solder joints under electric current stressing
International Journal of Solids and Structures, 41(9-10), 2743–2755.
author keywords: phase coarsening; current stressing; solder joints; electromigration
Sources: Crossref, ORCID
Added: September 5, 2021
2004 journal article
Deformation of solder joint under current stressing and numerical simulation––II
International Journal of Solids and Structures, 41(18-19), 4959–4973.
author keywords: solder joint; electromigration; Moire inteferometry; modeling
Sources: Crossref, ORCID
Added: September 5, 2021
2004 journal article
Deformation of solder joint under current stressing and numerical simulation––I
International Journal of Solids and Structures, 41(18-19), 4939–4958.
author keywords: electromigration; Moire interferometry; solder joint; modeling
Sources: Crossref, ORCID
Added: September 5, 2021
2004 journal article
Mechanical Implications of High Current Densities in Flip-chip Solder Joints
International Journal of Damage Mechanics, 13(4), 335–345.
author keywords: solder joint; reliability; electromigration; phase coarsening; thermomigration
Sources: Crossref, ORCID
Added: September 5, 2021
2004 journal article
Failure Modes of Flip Chip Solder Joints Under High Electric Current Density
Journal of Electronic Packaging, 127(2), 157–163.
author keywords: flip chip; solder joint reliability; electromigration; thermomigration; current stressing; high current density; power electronics; nanoelectronics
Sources: Crossref, ORCID
Added: September 5, 2021
2004 journal article
CAVA: Hiding L2 misses with checkpoint-assisted value prediction
IEEE Computer Architecture Letters, 3(1), 7–7.
Source: ORCID
Added: August 18, 2021
2004 conference paper
Adaptive Information Processing: An Effective Way to Improve Perceptron Branch Predictors
1st Championship Branch Prediction (CBP-1) held with the 37th International Symposium on Microarchitecture (MICRO-37).
Source: NC State University Libraries
Added: February 8, 2021
2004 journal article
Nonequilibrium electrons and phonons in thin film thermionic coolers
Microscale Thermophysical Engineering, 8(2), 91–100.
author keywords: thermionic; thermoelectric; nonequilibrium transport; hot carriers; thin film coolers
Source: Crossref
Added: January 24, 2021
2004 journal article
Pekar mechanism of electron-phonon interaction in nanostructures
Physica Status Solidi (c), 1(11), 2779–2782.
Source: Crossref
Added: January 14, 2021
2004 journal article
Linear boundary extensions for finite length signals and paraunitary two-channel filterbanks
IEEE Transactions on Signal Processing, 52(11), 3213–3226.
author keywords: border effects; boundary extensions; orthogonal transforms; smooth orthogonal extensions; two-channel filterbanks
Source: ORCID
Added: October 8, 2020
2004 conference paper
Cross-layer scheduling for power efficiency in wireless sensor networks
IEEE INFOCOM 2004.
Source: ORCID
Added: September 18, 2020
2004 conference paper
Multiuser space-time block coded MIMO system with downlink precoding
IEEE International Conference on Communications, 5, 2689–2693. http://www.scopus.com/inward/record.url?eid=2-s2.0-4143114693&partnerID=MN8TOARS
Source: ORCID
Added: September 11, 2020
2004 journal article
What is the value of limited feedback for MIMO channels?
IEEE Communications Magazine, 42(10), 54–59.
Source: ORCID
Added: September 11, 2020
2004 journal article
Special issue: Multiple-input multiple-output (MIMO) communications
Wireless Communications and Mobile Computing, 4(7), 593–696.
onlinelibrary.wiley.com (publisher PDF)
Source: ORCID
Added: September 11, 2020
2004 conference paper
Rapid MIMO-OFDM software defined radio system prototyping
IEEE Workshop on Signal Processing Systems, SiPS: Design and Implementation, 182–187. http://www.scopus.com/inward/record.url?eid=2-s2.0-17044378192&partnerID=MN8TOARS
Source: ORCID
Added: September 11, 2020
