Electrical & Computer Engineering

College of Engineering

Works Published in 2004

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Sorted by most recent date added to the index first, which may not be the same as publication date order.

2004 conference paper

Multi-Parameter Power Minimization of Synthesized Datapaths

IEEE Computer Society Annual Symposium on VLSI, 151–157.

By: W. Davis, A. Sule & H. Hua

Event: IEEE Computer Society Annual Symposium on VLSI at Lafayette, LA on February 19-20, 2004

Sources: NC State University Libraries, ORCID
Added: July 9, 2022

2004 conference paper

MM-wave transceivers using SiGe HBT technology

2004 Topical Meeting on Silicon Monolithic Integrated Circuits in RF Systems: Digest of Papers, 81–84. http://www.scopus.com/inward/record.url?eid=2-s2.0-20344405688&partnerID=MN8TOARS

By: B. Gaucher, T. Beukema, S. Reynolds, B. Floyd, T. Zwick, U. Pfeiffer, D. Liu, J. Cressler

Source: ORCID
Added: December 10, 2021

2004 conference paper

Deformation of Solder Joints Under Current Stressing: Experimental Measurement and Numerical Simulation

Presented at the 21st International Congress of Theoretical and Applied Mechanics, Warsaw, Poland.

By: C. Basaran, H. Ye & D. Hopkins

Event: 21st International Congress of Theoretical and Applied Mechanics at Warsaw, Poland on August 15-21, 2004

Source: NC State University Libraries
Added: November 4, 2021

2004 conference paper

Damage mechanics of microelectronics solder joints under high current densities

2004 Proceedings. 54th Electronic Components and Technology Conference (IEEE Cat. No.04CH37546). Presented at the 2004 54th Electronic Components and Technology Conference, Las Vegas, NV.

By: H. Ye, C. Basaran, D. Hopkins, D. Frear & J. Lin

Event: 2004 54th Electronic Components and Technology Conference at Las Vegas, NV on June 4, 2004

Sources: Crossref, ORCID
Added: September 5, 2021

2004 journal article

Pb phase coarsening in eutectic Pb/Sn flip chip solder joints under electric current stressing

International Journal of Solids and Structures, 41(9-10), 2743–2755.

By: H. Ye, C. Basaran & D. Hopkins

Sources: Crossref, ORCID
Added: September 5, 2021

2004 journal article

Deformation of solder joint under current stressing and numerical simulation––II

International Journal of Solids and Structures, 41(18-19), 4959–4973.

By: H. Ye, C. Basaran & D. Hopkins

Sources: Crossref, ORCID
Added: September 5, 2021

2004 journal article

Deformation of solder joint under current stressing and numerical simulation––I

International Journal of Solids and Structures, 41(18-19), 4939–4958.

By: H. Ye, C. Basaran & D. Hopkins

Sources: Crossref, ORCID
Added: September 5, 2021

2004 journal article

Mechanical Implications of High Current Densities in Flip-chip Solder Joints

International Journal of Damage Mechanics, 13(4), 335–345.

By: H. Ye, C. Basaran & D. Hopkins

Sources: Crossref, ORCID
Added: September 5, 2021

2004 journal article

Failure Modes of Flip Chip Solder Joints Under High Electric Current Density

Journal of Electronic Packaging, 127(2), 157–163.

By: C. Basaran, H. Ye, D. Hopkins, D. Frear & J. Lin

Sources: Crossref, ORCID
Added: September 5, 2021

2004 journal article

CAVA: Hiding L2 misses with checkpoint-assisted value prediction

IEEE Computer Architecture Letters, 3(1), 7–7.

By: L. Ceze, K. Strauss, J. Tuck, J. Renau & J. Torrellas

Source: ORCID
Added: August 18, 2021

2004 conference paper

Adaptive Information Processing: An Effective Way to Improve Perceptron Branch Predictors

1st Championship Branch Prediction (CBP-1) held with the 37th International Symposium on Microarchitecture (MICRO-37).

By: H. Gao & H. Zhou

Source: NC State University Libraries
Added: February 8, 2021

2004 journal article

Nonequilibrium electrons and phonons in thin film thermionic coolers

Microscale Thermophysical Engineering, 8(2), 91–100.

By: D. Vashaee & A. Shakouri

Source: Crossref
Added: January 24, 2021

2004 journal article

Pekar mechanism of electron-phonon interaction in nanostructures

Physica Status Solidi (c), 1(11), 2779–2782.

By: B. Glavin, V. Kochelap, T. Linnik & K. Kim

Source: Crossref
Added: January 14, 2021

2004 conference paper

Cross-layer scheduling for power efficiency in wireless sensor networks

IEEE INFOCOM 2004.

Source: ORCID
Added: September 18, 2020

2004 journal article

Deformation potentials of the E1(TO) and E2 modes of InN

Applied Physics Letters, 84(18), 3636–3638.

By: V. Darakchieva, P. Paskov, E. Valcheva, T. Paskova, B. Monemar, M. Schubert, H. Lu, W. Schaff

Source: Crossref
Added: August 28, 2020

2004 journal article

Infrared ellipsometry and Raman studies of hexagonal InN films: correlation between strain and vibrational properties

Superlattices and Microstructures, 36(4-6), 573–580.

By: V. Darakchieva, P. Paskov, E. Valcheva, T. Paskova, M. Schubert, C. Bundesmann, H. Lu, W. Schaff, B. Monemar

Source: Crossref
Added: August 28, 2020

2004 journal article

Free-to-bound radiative recombination in highly conducting InN epitaxial layers

Superlattices and Microstructures, 36(4-6), 563–571.

By: B. Arnaudov, T. Paskova, P. Paskov, B. Magnusson, E. Valcheva, B. Monemar, H. Lu, W. Schaff, H. Amano, I. Akasaki

Source: Crossref
Added: August 28, 2020

2004 journal article

Characterization of mass-transport grown GaN by hydride vapour-phase epitaxy

Journal of Crystal Growth, 273(1-2), 118–128.

By: T. Paskova, P. Paskov, E. Goldys, E. Valcheva, V. Darakchieva, U. Södervall, M. Godlewski, M. Zielinski ...

Source: Crossref
Added: August 28, 2020

2004 journal article

HVPE-GaN: comparison of emission properties and microstructure of films grown on different laterally overgrown templates

Diamond and Related Materials, 13(4-8), 1125–1129.

By: T. Paskova, E. Valcheva, P. Paskov, B. Monemar, A. Roskowski, R. Davis, B. Beaumont, P. Gibart

Source: Crossref
Added: August 28, 2020

2004 journal article

Hydride vapor-phase epitaxial GaN thick films for quasi-substrate applications: Strain distribution and wafer bending

Journal of Electronic Materials, 33(5), 389–394.

By: T. Paskova, V. Darakchieva, E. Valcheva, P. Paskov, I. Ivanov, B. Monemar, T. Böttcher, C. Roder, D. Hommel

Source: Crossref
Added: August 28, 2020