Electrical and Computer Engineering

Works Published in 2004

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Displaying works 1 - 20 of 253 in total

Sorted by most recent date added to the index first, which may not be the same as publication date order.

2004 journal article

InGaN/GaN quantum-well heterostructure light-emitting diodes employing photonic crystal structures

Applied Physics Letters, 84(19), 3885–3887.

By: J. Wierer*, M. Krames*, J. Epler*, N. Gardner*, M. Craford*, J. Wendt*, J. Simmons*, M. Sigalas*

co-author countries: United States of America 🇺🇸

Contributors: J. Wierer*, M. Krames*, J. Epler*, N. Gardner*, M. Craford*, J. Wendt*, J. Simmons*, M. Sigalas*

Source: ORCID
Added: October 31, 2023

2004 conference paper

Repeatability and intercorrelations of sensory and cognitive tests in unmedicated elderly subjects

Proceedings of the 2004 AChemS annual meeting. Presented at the 2004 AChemS annual meeting, Sarasota, FL.

By: S. Schiffman, S. Murray & E. Watson

Event: 2004 AChemS annual meeting at Sarasota, FL

Source: NC State University Libraries
Added: July 23, 2023

2004 chapter

Taste and smell

In K. C. Niedert & B. Dorner (Eds.), Nutrition care of the older adult: a handbook for dietetics professionals working throughout the continuum of care (2nd ed., pp. 89–93). Roche Dietitians.

By: S. Schiffman

Ed(s): K. Niedert & B. Dorner

Source: NC State University Libraries
Added: July 23, 2023

2004 journal article

Smell and behavior

ENT News, 12(6), 52–53.

By: S. Schiffman

Source: NC State University Libraries
Added: July 23, 2023

2004 conference paper

Power Packaging Techniques and High Current Applications

19th Annual IEEE Conference on Applied Power Electronics Conference and Exposition (APEC). Presented at the 19th Annual IEEE Conference on Applied Power Electronics Conference and Exposition (APEC), Anaheim, CA.

By: D. Hopkins

Event: 19th Annual IEEE Conference on Applied Power Electronics Conference and Exposition (APEC) at Anaheim, CA on February 22-26, 2004

Source: NC State University Libraries
Added: July 22, 2023

2004 chapter

Introduction to Olfaction: Perception, Anatomy, Physiology, and Molecular Biology

In Handbook of Machine Olfaction (pp. 1–31).

By: S. Schiffman* & T. Pearce*

co-author countries: United Kingdom of Great Britain and Northern Ireland 🇬🇧 United States of America 🇺🇸
Sources: Crossref, ORCID
Added: July 2, 2023

2004 chapter

Loss of Taste, Smell, and Other Senses with Age

In Handbook of Clinical Nutrition and Aging (pp. 211–289).

By: S. Schiffman*, M. Rogers & J. Zervakis

Sources: Crossref, ORCID
Added: July 2, 2023

2004 article proceedings

Evaluation of the Carbofil International Downflow Tube Reactor for Treatment of Swine Waste

Presented at the 2004, Ottawa, Canada August 1 - 4, 2004.

By: J. Classen & S. Schiffman*

Event: 2004, Ottawa, Canada August 1 - 4, 2004

Sources: Crossref, ORCID
Added: June 29, 2023

2004 journal article

Odor from Industrial Hog Farming Operations and Mucosal Immune Function in Neighbors

Archives of Environmental Health: An International Journal, 59(2), 101–108.

By: R. Avery*, S. Wing*, S. Marshall* & S. Schiffman*

co-author countries: United States of America 🇺🇸
MeSH headings : Adult; Aged; Animal Husbandry; Animals; Down-Regulation; Female; Humans; Immunity, Mucosal; Immunoglobulin A, Secretory / analysis; Male; Middle Aged; North Carolina; Odorants; Saliva / immunology; Stress, Psychological / immunology; Swine
Sources: Crossref, ORCID
Added: June 29, 2023

2004 journal article

DUST AND ODOR EMISSIONS FROM TUNNEL VENTILATED SWINE BUILDINGS IN NORTH CAROLINA AND COMPARISON OF DIFFERENT ODOR EVALUATION METHODS

Applied Engineering in Agriculture, 20(3), 343–347.

By: R. Bottcher, K. Keener, R. Munilla, C. Williams & S. Schiffman*

Sources: Crossref, ORCID
Added: June 29, 2023

2004 report

Miniature RF components enabled by mesoscale rapid manufacturing.

Sandia National Lab.(SNL-NM), Albuquerque, NM (United States).

By: J. Palmer, B. Jokiel, C. Nordquist, B. Kast, C. Atwood, R. Wicker, E. Grant, F. Livingston

Source: ORCID
Added: February 5, 2023

2004 conference paper

Multi-Parameter Power Minimization of Synthesized Datapaths

IEEE Computer Society Annual Symposium on VLSI, 151–157.

By: W. Davis n, A. Sule n & H. Hua n

co-author countries: United States of America 🇺🇸

Event: IEEE Computer Society Annual Symposium on VLSI at Lafayette, LA on February 19-20, 2004

Sources: Web Of Science, ORCID
Added: July 9, 2022

2004 conference paper

MM-wave transceivers using SiGe HBT technology

2004 Topical Meeting on Silicon Monolithic Integrated Circuits in RF Systems: Digest of Papers, 81–84. http://www.scopus.com/inward/record.url?eid=2-s2.0-20344405688&partnerID=MN8TOARS

By: B. Gaucher, T. Beukema, S. Reynolds, B. Floyd, T. Zwick, U. Pfeiffer, D. Liu, J. Cressler

Contributors: B. Gaucher, T. Beukema, S. Reynolds, B. Floyd, T. Zwick, U. Pfeiffer, D. Liu, J. Cressler

Source: ORCID
Added: December 10, 2021

2004 conference paper

Deformation of Solder Joints Under Current Stressing: Experimental Measurement and Numerical Simulation

Presented at the 21st International Congress of Theoretical and Applied Mechanics, Warsaw, Poland.

By: C. Basaran, H. Ye & D. Hopkins

Event: 21st International Congress of Theoretical and Applied Mechanics at Warsaw, Poland on August 15-21, 2004

Source: NC State University Libraries
Added: November 4, 2021

2004 conference paper

Damage mechanics of microelectronics solder joints under high current densities

2004 Proceedings. 54th Electronic Components and Technology Conference (IEEE Cat. No.04CH37546). Presented at the 2004 54th Electronic Components and Technology Conference, Las Vegas, NV.

By: H. Ye*, C. Basaran*, D. Hopkins*, D. Frear & J. Lin

co-author countries: United States of America 🇺🇸

Event: 2004 54th Electronic Components and Technology Conference at Las Vegas, NV on June 4, 2004

Sources: Crossref, ORCID
Added: September 5, 2021

2004 journal article

Pb phase coarsening in eutectic Pb/Sn flip chip solder joints under electric current stressing

International Journal of Solids and Structures, 41(9-10), 2743–2755.

By: H. Ye, C. Basaran & D. Hopkins*

author keywords: phase coarsening; current stressing; solder joints; electromigration
Sources: Crossref, ORCID
Added: September 5, 2021

2004 journal article

Deformation of solder joint under current stressing and numerical simulation––II

International Journal of Solids and Structures, 41(18-19), 4959–4973.

By: H. Ye, C. Basaran & D. Hopkins*

author keywords: solder joint; electromigration; Moire inteferometry; modeling
Sources: Crossref, ORCID
Added: September 5, 2021

2004 journal article

Deformation of solder joint under current stressing and numerical simulation––I

International Journal of Solids and Structures, 41(18-19), 4939–4958.

By: H. Ye, C. Basaran & D. Hopkins*

author keywords: electromigration; Moire interferometry; solder joint; modeling
Sources: Crossref, ORCID
Added: September 5, 2021

2004 journal article

Mechanical Implications of High Current Densities in Flip-chip Solder Joints

International Journal of Damage Mechanics, 13(4), 335–345.

By: H. Ye*, C. Basaran* & D. Hopkins*

co-author countries: United States of America 🇺🇸
author keywords: solder joint; reliability; electromigration; phase coarsening; thermomigration
Sources: Crossref, ORCID
Added: September 5, 2021

2004 journal article

Failure Modes of Flip Chip Solder Joints Under High Electric Current Density

Journal of Electronic Packaging, 127(2), 157–163.

By: C. Basaran*, H. Ye*, D. Hopkins*, D. Frear & J. Lin

co-author countries: United States of America 🇺🇸
author keywords: flip chip; solder joint reliability; electromigration; thermomigration; current stressing; high current density; power electronics; nanoelectronics
Sources: Crossref, ORCID
Added: September 5, 2021