Works Published in 2006
Displaying works 1 - 20 of 305 in total
Sorted by most recent date added to the index first, which may not be the same as publication date order.
2006 conference paper
Quantification of odor and odorants at swine facilities and assessment of their impact downwind
In V. P. Aneja, W. H. Schlesinger, R. Knighton, G. Jennings, D. Niyogi, W. Gilliam, & C. S. Duke (Eds.), Proceedings: Air quality: State of the science: Vol. V (pp. 136–137).
Ed(s): V. Aneja, W. Schlesinger, R. Knighton, G. Jennings, D. Niyogi, W. Gilliam, C. Duke
Event: Air quality: State of the science at Potomac, MD
Source: NC State University Libraries
Added: July 23, 2023
2006 conference paper
Advanced Power Electronics Packaging High-Current High Temperature Applications
21st Annual IEEE Conference on Applied Power Electronics Conference and Exposition (APEC). Presented at the 21st Annual IEEE Conference on Applied Power Electronics Conference and Exposition (APEC), New Orleans, LA.
Event: 21st Annual IEEE Conference on Applied Power Electronics Conference and Exposition (APEC) at New Orleans, LA on March 19-23, 2006
Source: NC State University Libraries
Added: July 22, 2023
2006 thesis
Development of an Internet Addressable Pneumatically Controlled Instrument for Applying Stain the Cells In-Vitro
(Dissertation). North Carolina State University, Raleigh, NC.
Source: NC State University Libraries
Added: February 11, 2023
2006 journal article
Development of an Internet Addressable Pneumatically Controlled Instrument for Applying Strain to Cells In-Vitro
Source: ORCID
Added: February 5, 2023
2006 chapter
Automated Architectural Exploration for Signal Processing Algorithms
In 2006 IEEE Workshop on Signal Processing Systems Design and Implementation (pp. 274–279,).
Event: 2006 IEEE Workshop on Signal Processing Systems Design and Implementation at Banff, AB, Canada on October 2-4, 2006
TL;DR:
This paper presents the view of a framework that combines common electronic design automation (EDA) tools to alleviate the designer from manually constructing the hardware models and analyzing their performance, and uses this framework to efficiently implement design optimizations that improve the performance of the overall hardware architectures.
(via Semantic Scholar)
Sources: Web Of Science, NC State University Libraries
Added: July 9, 2022
2006 conference paper
Architecture for Energy Efficient Sphere Decoding
2006 IEEE International SOC Conference, 267–270.
Event: 2006 IEEE International SOC Conference at Austin, TX on September 24-27, 2006
TL;DR:
An improved architecture forSphere Decoding is provided which aims to increase overall energy efficiency (b/s/mW) of the decoder and is based on a novel implementation which combines the use of a deeply pipelined data-path and "multi symbol vector" based approach to exploit the pipeline.
(via Semantic Scholar)
UN Sustainable Development Goal Categories
7. Affordable and Clean Energy
(OpenAlex)
11. Sustainable Cities and Communities
(Web of Science)
Sources: Web Of Science, NC State University Libraries
Added: July 9, 2022
2006 conference paper
Compact Electrothermal Modeling of an X-band MMIC
2006 IEEE MTT-S International Microwave Symposium Digest, 651–654.
Event: 2006 IEEE MTT-S International Microwave Symposium at San Francisco, CA on June 11-16, 2006
author keywords: MMIC; electrothermal effects; circuit simulation; modeling
citeseerx.ist.psu.edu (repository)
UN Sustainable Development Goal Categories
7. Affordable and Clean Energy
(Web of Science; OpenAlex)
Sources: Web Of Science, NC State University Libraries
Added: July 9, 2022
2006 conference paper
Performance Trend in Three-Dimensional Integrated Circuits
2006 International Interconnect Technology Conference, 45–47.
Event: 2006 International Interconnect Technology Conference at Burlingame, CA on June 5-7, 2006
TL;DR:
This work develops an automated design flow with 2D CAD tools to design 3DICs with the MIT Lincoln Lab 0.18mum three-tier fully depleted silicon on insulator (FDSOI) process, showing that the performance of3DIC shows up to two-generation advantage over its 2D counterpart with only three tiers.
(via Semantic Scholar)
Sources: NC State University Libraries, NC State University Libraries
Added: July 9, 2022
2006 conference paper
Exploring Compromises among Timing, Power and Temperature in Three-Dimensional Integrated Circuits
DAC '06: Proceedings of the 43rd annual Design Automation Conference, 997–1002.
Event: Design Automation Conference (DAC)
TL;DR:
Physical design experiments were performed on a low-power and a high-performance design in an existing 3DIC technology, and it is shown that thermal-vias offer no performance benefit for the low- power system and only marginal benefit forThe high- performance system.
(via Semantic Scholar)
UN Sustainable Development Goal Categories
7. Affordable and Clean Energy
(OpenAlex)
Sources: NC State University Libraries, NC State University Libraries
Added: July 9, 2022
2006 speech
Tool Integration for Signal Processing Architectural Exploration
Hourani, R., Jenkal, R., Davis, R., & Alexander, W. (2006, April). Presented at the Electronic Design Process (EDP) Workshop.
Event: Electronic Design Process (EDP) Workshop
Source: NC State University Libraries
Added: July 1, 2022
2006 conference paper
Breaking Rent’s Rule: Opportunities for 3D Interconnect Networks
VLSI Multilevel Interconnection (VMIC) Conference, 228–233.
Event: VLSI Multilevel Interconnection (VMIC) Conference on September 26-28, 2006
Source: NC State University Libraries
Added: July 1, 2022
2006 speech
Demystifying 3D ICs: The Pros and Cons of Going Vertical
Davis, W. R. (2006, April). Presented at the Virginia Tech ECE Department Seminar, Blacksburg, VA.
Event: Virginia Tech ECE Department Seminar at Blacksburg, VA on April 14, 2006
Source: NC State University Libraries
Added: July 1, 2022
2006 conference paper
A Network based, Delay-tolerant, Integrated Navigation System for a differential drive UGV using Harmonic Potential Field
Proceedings of the 45th IEEE Conference on Decision and Control.
TL;DR:
A delay-resistant sensory-motor module for navigating a differential drive unmanned ground vehicle (UGV) in an indoor cluttered environment and the structure of this module and its components are described.
(via Semantic Scholar)
Source: ORCID
Added: July 1, 2022
2006 conference paper
Aluminum-Based High-Temperature (>200°C) Packaging for SiC Power Converters
Proceedings 2006 International Symposium on Microelectronics : October 8-12, 2006 : San Diego Convention Center, San Diego, Calif., 734–741. Washington, D.C.: IMAPS.
Event: 39th International Microelectronics and Packaging Society (IMAPS) International Symposium on Microelectronics at San Diego, CA on October 8-12, 2006
Source: NC State University Libraries
Added: October 28, 2021
2006 conference paper
High-temperature, high-density packaging of a 60kW converter for >200/spl deg/C embedded operation
High-temperature, high-density packaging of a 60kW converter for >200/spl deg/C embedded operation. Twenty-First Annual IEEE Applied Power Electronics Conference and Exposition, 2006. APEC '06. Presented at the Twenty-First Annual IEEE Applied Power Electronics Conference and Exposition, 2006. APEC '06., Dallas, TX.
Event: Twenty-First Annual IEEE Applied Power Electronics Conference and Exposition, 2006. APEC '06. at Dallas, TX on March 19-23, 2006
UN Sustainable Development Goal Categories
7. Affordable and Clean Energy
(OpenAlex)
Sources: Crossref, NC State University Libraries
Added: September 5, 2021
2006 conference paper
Experimental Study of Thermomigration in Lead-Free Nanoelectronics Solder Joints
Electronic and Photonic Packaging, Electrical Systems Design and Photonics, and Nanotechnology. Presented at the ASME 2006 International Mechanical Engineering Congress and Exposition.
Event: ASME 2006 International Mechanical Engineering Congress and Exposition
Sources: Crossref, NC State University Libraries
Added: September 5, 2021
2006 journal article
Experimental Damage Mechanics of Micro/Power Electronics Solder Joints under Electric Current Stresses
International Journal of Damage Mechanics, 15(1), 41–67.
author keywords: thermomigration; electromigration; damage mechanics; solder joints; nanoelectronics; microelectronics; power electronics; solder joint reliability
Sources: Crossref, NC State University Libraries
Added: September 5, 2021
2006 article
System and method for non-uniform cache in a multi-core processor
Hughes, C., Tuck, J., Lee, V., & Chen, Y.-kuang. (2006, June).
Source: ORCID
Added: August 18, 2021
2006 journal article
Boosting SMT trace processors performance with data cache misssensitive thread scheduling mechanism
Microprocessors and Microsystems, 30(5), 225–233.
Source: ORCID
Added: August 18, 2021
2006 journal article
Energy-efficient thread-level speculation
IEEE Micro, 26(1), 80–91.
Source: ORCID
Added: August 18, 2021
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