College of Engineering
Displaying works 1 - 20 of 305 in total
Sorted by most recent date added to the index first, which may not be the same as publication date order.
2006 conference paper
Quantification of odor and odorants at swine facilities and assessment of their impact downwind
In V. P. Aneja, W. H. Schlesinger, R. Knighton, G. Jennings, D. Niyogi, W. Gilliam, & C. S. Duke (Eds.), Proceedings: Air quality: State of the science: Vol. V (pp. 136–137).
Ed(s): V. Aneja, W. Schlesinger, R. Knighton, G. Jennings, D. Niyogi, W. Gilliam, C. Duke
Event: Air quality: State of the science at Potomac, MD
2006 conference paper
Advanced Power Electronics Packaging High-Current High Temperature Applications
21st Annual IEEE Conference on Applied Power Electronics Conference and Exposition (APEC). Presented at the 21st Annual IEEE Conference on Applied Power Electronics Conference and Exposition (APEC), New Orleans, LA.
Event: 21st Annual IEEE Conference on Applied Power Electronics Conference and Exposition (APEC) at New Orleans, LA on March 19-23, 2006
2006 thesis
Development of an Internet Addressable Pneumatically Controlled Instrument for Applying Stain the Cells In-Vitro
(Dissertation). North Carolina State University, Raleigh, NC.
2006 journal article
Development of an Internet Addressable Pneumatically Controlled Instrument for Applying Strain to Cells In-Vitro
2006 chapter
Automated Architectural Exploration for Signal Processing Algorithms
In 2006 IEEE Workshop on Signal Processing Systems Design and Implementation (pp. 274–279,).
Event: 2006 IEEE Workshop on Signal Processing Systems Design and Implementation at Banff, AB, Canada on October 2-4, 2006
2006 conference paper
Architecture for Energy Efficient Sphere Decoding
2006 IEEE International SOC Conference, 267–270.
Event: 2006 IEEE International SOC Conference at Austin, TX on September 24-27, 2006
2006 conference paper
Compact Electrothermal Modeling of an X-band MMIC
2006 IEEE MTT-S International Microwave Symposium Digest, 651–654.
Event: 2006 IEEE MTT-S International Microwave Symposium at San Francisco, CA on June 11-16, 2006
2006 conference paper
Performance Trend in Three-Dimensional Integrated Circuits
2006 International Interconnect Technology Conference, 45–47.
Event: 2006 International Interconnect Technology Conference at Burlingame, CA on June 5-7, 2006
2006 conference paper
Exploring Compromises among Timing, Power and Temperature in Three-Dimensional Integrated Circuits
DAC '06: Proceedings of the 43rd annual Design Automation Conference, 997–1002.
Event: Design Automation Conference (DAC)
2006 speech
Tool Integration for Signal Processing Architectural Exploration
Hourani, R., Jenkal, R., Davis, R., & Alexander, W. (2006, April). Presented at the Electronic Design Process (EDP) Workshop.
Event: Electronic Design Process (EDP) Workshop
2006 conference paper
Breaking Rent’s Rule: Opportunities for 3D Interconnect Networks
VLSI Multilevel Interconnection (VMIC) Conference, 228–233.
Event: VLSI Multilevel Interconnection (VMIC) Conference on September 26-28, 2006
2006 speech
Demystifying 3D ICs: The Pros and Cons of Going Vertical
Davis, W. R. (2006, April). Presented at the Virginia Tech ECE Department Seminar, Blacksburg, VA.
Event: Virginia Tech ECE Department Seminar at Blacksburg, VA on April 14, 2006
2006 conference paper
A Network based, Delay-tolerant, Integrated Navigation System for a differential drive UGV using Harmonic Potential Field
Proceedings of the 45th IEEE Conference on Decision and Control.
2006 conference paper
Aluminum-Based High-Temperature (>200°C) Packaging for SiC Power Converters
Proceedings 2006 International Symposium on Microelectronics : October 8-12, 2006 : San Diego Convention Center, San Diego, Calif., 734–741. Washington, D.C.: IMAPS.
Event: 39th International Microelectronics and Packaging Society (IMAPS) International Symposium on Microelectronics at San Diego, CA on October 8-12, 2006
2006 conference paper
High-temperature, high-density packaging of a 60kW converter for >200/spl deg/C embedded operation
High-temperature, high-density packaging of a 60kW converter for >200/spl deg/C embedded operation. Twenty-First Annual IEEE Applied Power Electronics Conference and Exposition, 2006. APEC '06. Presented at the Twenty-First Annual IEEE Applied Power Electronics Conference and Exposition, 2006. APEC '06., Dallas, TX.
Event: Twenty-First Annual IEEE Applied Power Electronics Conference and Exposition, 2006. APEC '06. at Dallas, TX on March 19-23, 2006
2006 conference paper
Experimental Study of Thermomigration in Lead-Free Nanoelectronics Solder Joints
Electronic and Photonic Packaging, Electrical Systems Design and Photonics, and Nanotechnology. Presented at the ASME 2006 International Mechanical Engineering Congress and Exposition.
Event: ASME 2006 International Mechanical Engineering Congress and Exposition
2006 journal article
Experimental Damage Mechanics of Micro/Power Electronics Solder Joints under Electric Current Stresses
International Journal of Damage Mechanics, 15(1), 41–67.
2006 article
System and method for non-uniform cache in a multi-core processor
Hughes, C., Tuck, J., Lee, V., & Chen, Y.-kuang. (2006, June).
2006 journal article
Boosting SMT trace processors performance with data cache misssensitive thread scheduling mechanism
Microprocessors and Microsystems, 30(5), 225–233.
2006 journal article
Energy-efficient thread-level speculation
IEEE Micro, 26(1), 80–91.