Electrical & Computer Engineering

College of Engineering

Works Published in 2002

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Sorted by most recent date added to the index first, which may not be the same as publication date order.

2002 conference paper

Implementation of high throughput soft output viterbi decoders

IEEE Workshop on Signal Processing Systems, 146–151.

By: E. Yeo, S. Augsburger, W. Davis & B. Nikolić

Event: IEEE Workshop on Signal Processing Systems at San Diego, CA on October 16-18, 2002

Sources: NC State University Libraries, ORCID
Added: July 9, 2022

2002 journal article

A Design Environment for High-Throughput, Low-Power Dedicated Signal Processing Systems

IEEE Journal of Solid State Circuits, 37(3), 420–431.

By: W. Davis, N. Zhang, K. Camera, D. Marković, T. Smilkstein, M. Ammer, E. Yeo, S. Augsburger, B. Nikolić, R. Brodersen

Sources: NC State University Libraries, ORCID
Added: July 9, 2022

2002 thesis

A Hierarchical, Automated Design Flow for Low-Power, High-Throughput Digital Signal Processing IC’s

(PhD Thesis). Electrical Engineering Department, University of California, Berkeley.

By: W. Davis

Source: NC State University Libraries
Added: July 1, 2022

2002 conference paper

500 Mb/s Soft Output Viterbi Decoder

European Solid-State Circuits Conference (ESSCIRC), 523–526,

By: E. Yeo, S. Augsburger, W. Davis & B. Nikolić

Event: European Solid-State Circuits Conference (ESSCIRC)

Source: NC State University Libraries
Added: July 1, 2022

2002 conference paper

Jitter in a wireless clock distribution system

Proceedings of the IEEE 2002 International Interconnect Technology Conference, IITC 2002, 154–156.

By: T. Dickson, B. Floyd & K. O

Source: ORCID
Added: December 10, 2021

2002 conference paper

Wireless Interconnects for Clock Distribution

ACM/IEEE International Workshop on Timing Issues in the Specification and Synthesis of Digital Systems, 105–108.

By: B. Floyd, X. Guo, J. Caserta, T. Dickson, C. Hung, K. Kim, K. O

Source: ORCID
Added: December 10, 2021

2002 conference paper

Propagation layers for intra-chip wireless interconnection compatible with packaging and heat removal

IEEE Symposium on VLSI Circuits, Digest of Technical Papers, 36–37. http://www.scopus.com/inward/record.url?eid=2-s2.0-0036057339&partnerID=MN8TOARS

By: X. Guo, J. Caserta, R. Li, B. Floyd & K. O

Source: ORCID
Added: December 10, 2021

2002 conference paper

A direct-conversion receiver IC for WCDMA mobile systems

Proceedings of the IEEE Bipolar/BiCMOS Circuits and Technology Meeting, 61–64. http://www.scopus.com/inward/record.url?eid=2-s2.0-0036437922&partnerID=MN8TOARS

By: S. Reynolds, B. Floyd, T. Beukema, T. Zwick, U. Pfeiffer & H. Ainspan

Source: ORCID
Added: December 10, 2021

2002 conference paper

Experimental Study on Reliability of Solder Joints under Electrical Stressing -Nano-indentation, Atomic Flux Measurement

SPIE proceedings series, 4828, 231–236. SPIE: Bellingham, Washington.

By: H. Ye, C. Basaran & D. Hopkins

Event: 2002 International Microelectronics Assembly and Packaging Society (IMAPS) International Conference on Advanced Packaging and Systems at Reno, Nevada on March 10-13, 2002

Source: NC State University Libraries
Added: October 28, 2021

2002 conference paper

Measurement and Effects of High Electrical Current Stress in Solder Joints

Proceedings of the 35th International Symposium on Microelectronics, 427–432.

By: H. Ye, D. Hopkins & C. Basaran

Event: 35th International Symposium on Microelectronics at Denver, Colorado on September 4, 2002

Source: NC State University Libraries
Added: October 28, 2021

2002 conference paper

Synthesis of a new class of converters that utilize energy recirculation

Proceedings of 1994 Power Electronics Specialist Conference - PESC'94. Presented at the 1994 Power Electronics Specialist Conference - PESC'94, Taipei, Taiwan.

By: D. Hopkins & D. Root

Event: 1994 Power Electronics Specialist Conference - PESC'94 at Taipei, Taiwan on June 20-25, 1994

Sources: Crossref, ORCID
Added: September 5, 2021

2002 conference paper

Packaging issues for next generation high voltage, high temperature power electronic modules

Proceedings of APEC 97 - Applied Power Electronics Conference. Presented at the APEC 97 - Applied Power Electronics Conference, Atlanta, GA.

By: J. Bowers, D. Hopkins & W. Sarjeant

Event: APEC 97 - Applied Power Electronics Conference at Atlanta, GA on February 27, 1997

Sources: Crossref, ORCID
Added: September 5, 2021

2002 conference paper

A framework for developing power electronics packaging

APEC '98 Thirteenth Annual Applied Power Electronics Conference and Exposition. Presented at the APEC '98 Thirteenth Annual Applied Power Electronics Conference and Exposition, Anaheim, CA.

By: D. Hopkins, S. Mathuna, A. Alderman & J. Flannery

Event: APEC '98 Thirteenth Annual Applied Power Electronics Conference and Exposition at Anaheim, CA on February 15-19, 1998

Sources: Crossref, ORCID
Added: September 5, 2021

2002 conference paper

Power packaging of a 12 kV, 240°C passive electronic module

APEC '98 Thirteenth Annual Applied Power Electronics Conference and Exposition. Presented at the APEC '98 Thirteenth Annual Applied Power Electronics Conference and Exposition, Anaheim, CA.

By: J. Bowers, D. Hopkins & W. Sarjeant

Event: APEC '98 Thirteenth Annual Applied Power Electronics Conference and Exposition at Anaheim, CA on February 15-19, 1998

Sources: Crossref, ORCID
Added: September 5, 2021

2002 conference paper

A high speed pulser thyristor

APEC '98 Thirteenth Annual Applied Power Electronics Conference and Exposition. Presented at the APEC '98 Thirteenth Annual Applied Power Electronics Conference and Exposition, Anaheim, CA.

By: A. Craig, D. Hopkins & J. Driscoll

Event: APEC '98 Thirteenth Annual Applied Power Electronics Conference and Exposition at Anaheim, CA on February 15-19, 1998

Sources: Crossref, ORCID
Added: September 5, 2021

2002 conference paper

Optimally selecting packaging technologies and circuit partitions based on cost and performance

APEC 2000. Fifteenth Annual IEEE Applied Power Electronics Conference and Exposition (Cat. No.00CH37058). Presented at the APEC 2000 - Applied Power Electronics Conference, New Orleans, LA.

By: J. Jacobsen & D. Hopkins

Event: APEC 2000 - Applied Power Electronics Conference at New Orleans, LA on February 6-10, 2000

Sources: Crossref, ORCID
Added: September 5, 2021

2002 conference paper

Characterization of advanced materials for high voltage/high temperature power electronics packaging

APEC 2001. Sixteenth Annual IEEE Applied Power Electronics Conference and Exposition (Cat. No.01CH37181). Presented at the 16th Annual Applied Power Electronics Conference - APEC 2001, Anaheim, CA.

By: D. Hopkins & J. Bowers

Event: 16th Annual Applied Power Electronics Conference - APEC 2001 at Anaheim, CA on March 4-8, 2001

Sources: Crossref, ORCID
Added: September 5, 2021

2002 conference paper

Mechanical Implications of High Current Densities in Flip Chip Solder Joints

Electronic and Photonic Packaging, Electrical Systems Design and Photonics, and Nanotechnology. Presented at the ASME 2002 International Mechanical Engineering Congress and Exposition.

By: H. Ye, C. Basaran & D. Hopkins

Event: ASME 2002 International Mechanical Engineering Congress and Exposition

Sources: Crossref, ORCID
Added: September 5, 2021

2002 journal article

Sphinx parallelization

Dept. of Computer Science, University of Illinois, Tech. Rep. UIUCDCS.

By: L. Baugh, J. Renau, J. Tuck & J. Torrellas

Source: ORCID
Added: August 18, 2021

2002 journal article

Morphable multithreaded memory tiles (M3T) architecture

University of Illinois UIUC-CS Technical Report.

By: J. Renau, J. Tuck, W. Liu & J. Torrellas

Source: ORCID
Added: August 18, 2021