College of Engineering
Displaying works 1 - 20 of 208 in total
Sorted by most recent date added to the index first, which may not be the same as publication date order.
2002 conference paper
Implementation of high throughput soft output viterbi decoders
IEEE Workshop on Signal Processing Systems, 146–151.
Event: IEEE Workshop on Signal Processing Systems at San Diego, CA on October 16-18, 2002
2002 journal article
A Design Environment for High-Throughput, Low-Power Dedicated Signal Processing Systems
IEEE Journal of Solid State Circuits, 37(3), 420–431.
2002 thesis
A Hierarchical, Automated Design Flow for Low-Power, High-Throughput Digital Signal Processing IC’s
(PhD Thesis). Electrical Engineering Department, University of California, Berkeley.
2002 conference paper
500 Mb/s Soft Output Viterbi Decoder
European Solid-State Circuits Conference (ESSCIRC), 523–526,
Event: European Solid-State Circuits Conference (ESSCIRC)
2002 conference paper
Jitter in a wireless clock distribution system
Proceedings of the IEEE 2002 International Interconnect Technology Conference, IITC 2002, 154–156.
2002 conference paper
Wireless Interconnects for Clock Distribution
ACM/IEEE International Workshop on Timing Issues in the Specification and Synthesis of Digital Systems, 105–108.
2002 conference paper
Propagation layers for intra-chip wireless interconnection compatible with packaging and heat removal
IEEE Symposium on VLSI Circuits, Digest of Technical Papers, 36–37. http://www.scopus.com/inward/record.url?eid=2-s2.0-0036057339&partnerID=MN8TOARS
2002 conference paper
A direct-conversion receiver IC for WCDMA mobile systems
Proceedings of the IEEE Bipolar/BiCMOS Circuits and Technology Meeting, 61–64. http://www.scopus.com/inward/record.url?eid=2-s2.0-0036437922&partnerID=MN8TOARS
2002 conference paper
Experimental Study on Reliability of Solder Joints under Electrical Stressing -Nano-indentation, Atomic Flux Measurement
SPIE proceedings series, 4828, 231–236. SPIE: Bellingham, Washington.
Event: 2002 International Microelectronics Assembly and Packaging Society (IMAPS) International Conference on Advanced Packaging and Systems at Reno, Nevada on March 10-13, 2002
2002 conference paper
Measurement and Effects of High Electrical Current Stress in Solder Joints
Proceedings of the 35th International Symposium on Microelectronics, 427–432.
Event: 35th International Symposium on Microelectronics at Denver, Colorado on September 4, 2002
2002 conference paper
Synthesis of a new class of converters that utilize energy recirculation
Proceedings of 1994 Power Electronics Specialist Conference - PESC'94. Presented at the 1994 Power Electronics Specialist Conference - PESC'94, Taipei, Taiwan.
Event: 1994 Power Electronics Specialist Conference - PESC'94 at Taipei, Taiwan on June 20-25, 1994
2002 conference paper
Packaging issues for next generation high voltage, high temperature power electronic modules
Proceedings of APEC 97 - Applied Power Electronics Conference. Presented at the APEC 97 - Applied Power Electronics Conference, Atlanta, GA.
Event: APEC 97 - Applied Power Electronics Conference at Atlanta, GA on February 27, 1997
2002 conference paper
A framework for developing power electronics packaging
APEC '98 Thirteenth Annual Applied Power Electronics Conference and Exposition. Presented at the APEC '98 Thirteenth Annual Applied Power Electronics Conference and Exposition, Anaheim, CA.
Event: APEC '98 Thirteenth Annual Applied Power Electronics Conference and Exposition at Anaheim, CA on February 15-19, 1998
2002 conference paper
Power packaging of a 12 kV, 240°C passive electronic module
APEC '98 Thirteenth Annual Applied Power Electronics Conference and Exposition. Presented at the APEC '98 Thirteenth Annual Applied Power Electronics Conference and Exposition, Anaheim, CA.
Event: APEC '98 Thirteenth Annual Applied Power Electronics Conference and Exposition at Anaheim, CA on February 15-19, 1998
2002 conference paper
A high speed pulser thyristor
APEC '98 Thirteenth Annual Applied Power Electronics Conference and Exposition. Presented at the APEC '98 Thirteenth Annual Applied Power Electronics Conference and Exposition, Anaheim, CA.
Event: APEC '98 Thirteenth Annual Applied Power Electronics Conference and Exposition at Anaheim, CA on February 15-19, 1998
2002 conference paper
Optimally selecting packaging technologies and circuit partitions based on cost and performance
APEC 2000. Fifteenth Annual IEEE Applied Power Electronics Conference and Exposition (Cat. No.00CH37058). Presented at the APEC 2000 - Applied Power Electronics Conference, New Orleans, LA.
Event: APEC 2000 - Applied Power Electronics Conference at New Orleans, LA on February 6-10, 2000
2002 conference paper
Characterization of advanced materials for high voltage/high temperature power electronics packaging
APEC 2001. Sixteenth Annual IEEE Applied Power Electronics Conference and Exposition (Cat. No.01CH37181). Presented at the 16th Annual Applied Power Electronics Conference - APEC 2001, Anaheim, CA.
Event: 16th Annual Applied Power Electronics Conference - APEC 2001 at Anaheim, CA on March 4-8, 2001
2002 conference paper
Mechanical Implications of High Current Densities in Flip Chip Solder Joints
Electronic and Photonic Packaging, Electrical Systems Design and Photonics, and Nanotechnology. Presented at the ASME 2002 International Mechanical Engineering Congress and Exposition.
Event: ASME 2002 International Mechanical Engineering Congress and Exposition
2002 journal article
Sphinx parallelization
Dept. of Computer Science, University of Illinois, Tech. Rep. UIUCDCS.
2002 journal article
Morphable multithreaded memory tiles (M3T) architecture
University of Illinois UIUC-CS Technical Report.
