Displaying works 1 - 20 of 294 in total
Sorted by most recent date added to the index first, which may not be the same as publication date order.
2007 journal article
Combination of flavor enhancement and chemosensory education improves nutritional status in older cancer patients
Journal of Nutrition, Health, and Aging, 11(5), 439–454.
2007 conference paper
Advanced Power Packaging for High Reliability and Higher Temperatures
40th International Symposium on Microelectronics. Presented at the 40th International Symposium on Microelectronics, San Jose, CA.
Event: 40th International Symposium on Microelectronics at San Jose, CA on November 10-15, 2007
2007 conference paper
Introduction to Power Packaging Techniques
22nd Annual IEEE Conference on Applied Power Electronics Conference and Exposition (APEC). Presented at the 22nd Annual IEEE Conference on Applied Power Electronics Conference and Exposition (APEC), Anaheim, CA.
Event: 22nd Annual IEEE Conference on Applied Power Electronics Conference and Exposition (APEC) at Anaheim, CA on February 25 - March 1, 2007
2007 journal article
Critical illness and changes in sensory perception
Proceedings of the Nutrition Society, 66(3), 331–345.
2007 chapter book
Smell and Taste
2007 journal article
Time to maximum sweetness intensity of binary and ternary blends of sweeteners
Food Quality and Preference, 18(2), 405–415.
2007 conference paper
Modeling and Optimization Analysis of Single Flagellum Bacterial Motion
2007 American Control Conference.
2007 conference paper
An Architecture for Energy Efficient Sphere Decoding
ISLPED '07: Proceedings of the 2007 international symposium on Low power electronics and design, 244–249.
Event: International Symposium on Low Power Electronics and Design (ISLPED on August 27-29, 2007
2007 conference paper
Designing FIFO Buffers using 3DIC Technology
VLSI Multilevel Interconnection (VMIC) Conference, 267–272.
Event: VLSI Multilevel Interconnection (VMIC) Conference on September 25-28, 2007
2007 conference paper
FreePDK: An Open Source, OpenAccess Design Kit
Davis, W. R. (2007, November 5). Presented at the OpenAccess Conference.
Event: OpenAccess Conference on November 5, 2007
2007 speech
Energy-Efficient Sphere Decoding (and other research efforts
Davis, W. R. (2007, September). Presented at the DARPA/OSD Trusted Foundry Circuit Designers Meeting, Essex Junction, VT.
Event: DARPA/OSD Trusted Foundry Circuit Designers Meeting at Essex Junction, VT on September 13, 2007
2007 speech
3D-IC Design: Theory vs. Reality
Davis, W. R. (2007, June). Presented at the University of Utah ECE Department Seminar, Salt Lake City, UT.
Event: University of Utah ECE Department Seminar at Salt Lake City, UT on June 21, 2007
2007 journal article
3D Interconnect Device Design: Theory vs. Reality
Future Fab International, (23), 38–40.
2007 conference paper
Information security with real-time operation: performance assessment for next generation wireless distributed networked-control-systems
IECON 2007 - 33rd Annual Conference of the IEEE Industrial Electronics Society.
2007 article
Characterization of data-sensitive wireless distributed networked-control-systems
2007 IEEE/ASME International Conference on Advanced Intelligent Mechatronics.
2007 journal article
Silicon germanium based millimetre-wave ICs for Gbps wireless communications and radar systems
Semiconductor Science and Technology, 22(1).
Contributors: B. Gaucher*, B. Floyd* , S. Reynolds*, U. Pfeiffer *, J. Grzyb *, A. Joseph, E. Mina, B. Orner
2007 conference paper
The effect of layer thickness variation on the thermo-mechanical properties of direct aluminum bonded substrates on AlSiC
Proceedings of the 2007 International Symposium on Microelectronics : November 11-15, 2007, San Jose Convention Center, san Jose, California, USA. Presented at the 40th International Microelectronics and Packaging Society (IMAPS) International Symposium on Microelectronics, San Jose, CA.
Event: 40th International Microelectronics and Packaging Society (IMAPS) International Symposium on Microelectronics at San Jose, CA on November 11-15, 2007
2007 conference paper
Solder Interconnect Electromigration Due to Time Varying Current Stressing
Proceedings of the 2007 International Symposium on Microelectronics : November 11-15, 2007, San Jose Convention Center, San Jose, California, USA, 10. Washington, D.C.: IMAPS.
Event: 40th International Microelectronics and Packaging Society (IMAPS) International Symposium on Microelectronics at San Jose, CA on November 11-15, 2007
2007 conference paper
A Review of Electromigration Under Time Varying Current Stressing
Enser, K. E., Hopkins, D. C., & Basaran, C. (2007, April 19). Presented at the Society of Automotive Engineers (SAE) International Symposium, Toronto, Canada.
Event: Society of Automotive Engineers (SAE) International Symposium at Toronto, Canada on April 19, 2007
2007 conference paper
IMC Effects in Solder from High Thermal Gradients Management
Presented at the International Electronics Packaging Symposium, Niskayuna, NY.
Event: International Electronics Packaging Symposium at Niskayuna, NY on July 31 - August 1, 2007
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