Works Published in 2008
Displaying works 121 - 140 of 303 in total
Sorted by most recent date added to the index first, which may not be the same as publication date order.
2008 chapter
Load Component Database of Household Appliances and Small Office Equipment
In 2008 Ieee Power & Energy Society General Meeting, Vols 1-11 (pp. 4656-+). http://gateway.webofknowledge.com/gateway/Gateway.cgi?GWVersion=2&SrcAuth=ORCID&SrcApp=OrcidOrg&DestLinkType=FullRecord&DestApp=WOS_CPL&KeyUT=WOS:000264403802264&KeyUID=WOS:000264403802264
Contributors: N. Lu , Y. Xie, Z. Huang, F. Puyleart, S. Yang & . Ieee
Source: ORCID
Added: May 6, 2019
2008 speech
Miniaturized chemical sensor array for detection of warfare agents
Park, K. K., Lee, H. J., Kupnik, M., Oralkan, Ö., & Khuri-Yakub, B. T. (2008, May). Presented at the 8th International Symposium on Technology and the Mine Problem Naval Postgraduate School, Monterey, CA.
Event: 8th International Symposium on Technology and the Mine Problem Naval Postgraduate School at Monterey, CA on May 6-8, 2008
Source: NC State University Libraries
Added: April 24, 2019
2008 conference paper
Development of nanoparticle-based gold contrast agent for photoacoustic tomography
Technical Proceedings of NSTI Nanotech, 1, 708–711.
Source: NC State University Libraries
Added: April 21, 2019
2008 conference paper
Extreme Temperature Invariant Circuitry Through Adaptive Body Biasing
GOMACTECH.
Source: NC State University Libraries
Added: April 15, 2019
2008 conference paper
Computer-Aided Design and Application Exploration for 3D Integrated Circuits
GOMACTECH.
Source: NC State University Libraries
Added: April 15, 2019
2008 conference paper
Multimode signaling on non-ideal channels
2008 IEEE-EPEP Electrical Performance of Electronic Packaging, 51–54.
Sources: NC State University Libraries, NC State University Libraries
Added: April 15, 2019
2008 conference paper
Autonomous Vision Processing and 3D Scene Reconstruction
GOMACTECH.
Source: NC State University Libraries
Added: April 14, 2019
2008 conference paper
Application Specific Integrated Circuit Verification: An Illustration Based Approach
IEEE MSE.
Source: NC State University Libraries
Added: April 14, 2019
2008 conference paper
Application and Design Exploration for 3D Integrated Circuits
VLSI Multi-level Interconnect Conference.
Source: NC State University Libraries
Added: April 11, 2019
2008 conference paper
Design and CAD for 3D integrated circuits
Proceedings of the 45th annual conference on Design automation - DAC '08, 668–673.
Event: the 45th annual conference
TL;DR:
This paper presents several case studies that are uniquely enhanced through 3D implementation, including a 3D CAM, an FFT processor, and a SAR processor, which requires higher fidelity thermal modeling than 2DIC design.
(via Semantic Scholar)
Sources: Crossref, NC State University Libraries, NC State University Libraries
Added: March 24, 2019
2008 conference paper
Keeping hot chips cool
Proceedings of the 45th annual conference on Design automation - DAC '08. Presented at the the 45th annual conference.
Event: the 45th annual conference
TL;DR:
This is an educational panel with a little bit of controversy that will address the thermal issue in IC design and the severity of power issues coupled with packaging complexity translate into a thermal crisis in future.
(via Semantic Scholar)
Sources: Crossref, NC State University Libraries
Added: March 24, 2019
2008 conference paper
Analysis of inter-bundle crosstalk in multimode signaling for high-density interconnects
2008 58th Electronic Components and Technology Conference. Presented at the 2008 58th Electronic Components and Technology Conference (ECTC 2008).
Event: 2008 58th Electronic Components and Technology Conference (ECTC 2008)
Sources: Crossref, NC State University Libraries
Added: March 24, 2019
2008 conference paper
AC coupled backplane communication using embedded capacitor
2008 IEEE-EPEP Electrical Performance of Electronic Packaging. Presented at the 2008 IEEE 17th Conference on Electrical Performance of Electronic Packaging (EPEP).
Event: 2008 IEEE 17th Conference on Electrical Performance of Electronic Packaging (EPEP)
Sources: Crossref, NC State University Libraries
Added: March 24, 2019
2008 conference paper
An 8192-point fast fourier transform 3D-IC case study
2008 51st Midwest Symposium on Circuits and Systems, 438–441.
Event: 2008 51st IEEE International Midwest Symposium on Circuits and Systems (MWSCAS) at Knoxville, TN on August 10-13, 2008
TL;DR:
This paper presents a case studies of an 8192-point fast Fourier transform (FFT) processor in order to quantify the benefit of the through-silicon vias in an available 180 nm 3D process.
(via Semantic Scholar)
UN Sustainable Development Goal Categories
7. Affordable and Clean Energy
(OpenAlex)
9. Industry, Innovation and Infrastructure
(Web of Science)
Sources: Crossref, NC State University Libraries, Web Of Science
Added: March 24, 2019
2008 conference paper
Memory rich applications for 3D integration
In S. F. Al-Sarawi, V. K. Varadan, N. Weste, & K. Kalantar-Zadeh (Eds.), Smart Structures, Devices, and Systems IV.
Ed(s): S. Al-Sarawi, V. Varadan, N. Weste & K. Kalantar-Zadeh
Event: Smart Materials, Nano-and Micro-Smart Systems
TL;DR:
This paper shows how memory power and memory bandwidth can both be improved by an order of magnitude through 3D integration, and specifically explores a DSP application.
(via Semantic Scholar)
Sources: Crossref, NC State University Libraries
Added: March 24, 2019
2008 conference paper
Fabricating capacitive micromachined ultrasonic transducers with direct wafer-bonding and LOCOS technology
2008 IEEE 21st International Conference on Micro Electro Mechanical Systems. Presented at the 2008 IEEE 21st International Conference on Micro Electro Mechanical Systems.
Event: 2008 IEEE 21st International Conference on Micro Electro Mechanical Systems
Sources: Crossref, NC State University Libraries
Added: March 24, 2019
2008 conference paper
CMUT as a chemical sensor for DMMP detection
2008 IEEE International Frequency Control Symposium. Presented at the 2008 IEEE International Frequency Control Symposium.
Event: 2008 IEEE International Frequency Control Symposium
Sources: Crossref, NC State University Libraries
Added: March 24, 2019
2008 conference paper
Capacitive micromachined ultrasonic transducer as a chemical sensor
2008 IEEE Sensors. Presented at the 2008 IEEE Sensors.
Event: 2008 IEEE Sensors
Sources: Crossref, NC State University Libraries
Added: March 24, 2019
2008 conference paper
Investigating large 2D arrays for photoacoustic and acoustic imaging using CMUT technology
2008 IEEE Ultrasonics Symposium. Presented at the 2008 IEEE Ultrasonics Symposium (IUS).
Event: 2008 IEEE Ultrasonics Symposium (IUS)
TL;DR:
Using a large aperture (64 times 64 element array) to perform photoacoustic and acoustic imaging by mechanically scanning a smaller array of capacitive micromachined ultrasonic transducers (CMUTs) is investigated.
(via Semantic Scholar)
UN Sustainable Development Goal Categories
14. Life Below Water
(OpenAlex)
Sources: Crossref, NC State University Libraries
Added: March 24, 2019
2008 conference paper
Optimum design of circular CMUT membranes for high quality factor in air
2008 IEEE Ultrasonics Symposium. Presented at the 2008 IEEE Ultrasonics Symposium (IUS).
Event: 2008 IEEE Ultrasonics Symposium (IUS)
author keywords: CMUT; Quality factor; Air damping; Circular membrane
TL;DR:
The optimum aspect ratio of membrane exists for maximum quality factor of CMUT, and the optimum design of circular membrane for high quality factor is presented.
(via Semantic Scholar)
Sources: Crossref, NC State University Libraries
Added: March 24, 2019
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