Electrical and Computer Engineering

Works Published in 2006

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Displaying works 101 - 120 of 305 in total

Sorted by most recent date added to the index first, which may not be the same as publication date order.

2006 conference paper

AC Coupled Interconnect using Buried Bumps for Laminated Organic Packages

Proceedings Electronic Components and Technology, ECTC.

By: J. Wilson, L. Luo, S. Mick, B. Chan, H. Lin & P. Franzon

Source: NC State University Libraries
Added: April 15, 2019

2006 conference paper

Pulse Signaling in Inductively Coupled Sockets and Connectors

SRC Student Symposium.

By: J. Xu, J. Wilson, E. Erickson & P. Franzon

Source: NC State University Libraries
Added: April 14, 2019

2006 conference paper

Sudocodes – Fast Measurement and Reconstruction of Sparse Signals

2006 IEEE International Symposium on Information Theory. Presented at the 2006 IEEE International Symposium on Information Theory.

By: S. Sarvotham*, D. Baron* & R. Baraniuk*

co-author countries: United States of America 🇺🇸

Event: 2006 IEEE International Symposium on Information Theory

Sources: Crossref, ORCID
Added: April 11, 2019

2006 conference paper

SiGe ICs for gigabit wireless transmission

Floyd, B., & Gaucher, B. (2006, August). Presented at the IEEE Lester Eastman Conference on High Performance Devices.

By: B. Floyd & B. Gaucher

Event: IEEE Lester Eastman Conference on High Performance Devices

Source: NC State University Libraries
Added: April 11, 2019

2006 conference paper

Silicon germanium based millimeter wave IC’s for Gbps wireless communication and radar systems

Government Microcircuit Applications Conference Digital Papers.

By: B. Gaucher, B. Floyd, S. Reynolds, U. Pfeiffer, A. Joseph, E. Mina, B. Orner, R. Wachnik, K. Walters

Source: NC State University Libraries
Added: April 11, 2019

2006 conference paper

Photoacoustic imaging using a two-dimensional CMUT array

IEEE Ultrasonics Symposium, 2005. Presented at the IEEE Ultrasonics Symposium, 2005.

By: I. Wygant*, X. Zhuang*, P. Kuo*, D. Yeh*, O. Oralkan* & B. Khuri-Yakub*

co-author countries: United States of America 🇺🇸

Event: IEEE Ultrasonics Symposium, 2005.

Sources: Crossref, ORCID
Added: March 30, 2019

2006 conference paper

An endoscopic imaging system based on a two-dimensional CMUT array: real-time imaging results

IEEE Ultrasonics Symposium, 2005. Presented at the IEEE Ultrasonics Symposium, 2005.

By: I. Wygant*, X. Zhuang*, D. Yeh*, S. Vaithilingam*, A. Nikoozadeh*, O. Oralkan*, A. Ergun*, M. Karaman*, B. Khuri-Yakub*

co-author countries: Türkiye 🇹🇷 United States of America 🇺🇸

Event: IEEE Ultrasonics Symposium, 2005.

Sources: Crossref, ORCID
Added: March 30, 2019

2006 conference paper

High-resolution imaging with high-frequency 1-D linear CMUT arrays

IEEE Ultrasonics Symposium, 2005. Presented at the IEEE Ultrasonics Symposium, 2005.

By: D. Yeh*, O. Oralkan*, I. Wygant*, A. Ergun*, J. Wong* & B. Khuri-Yakub*

co-author countries: United States of America 🇺🇸

Event: IEEE Ultrasonics Symposium, 2005.

Sources: Crossref, ORCID
Added: March 30, 2019

2006 conference paper

3-D ultrasound imaging using forward viewing CMUT ring arrays for intravascular and intracardiac applications

IEEE Ultrasonics Symposium, 2005. Presented at the IEEE Ultrasonics Symposium, 2005.

By: D. Yeh*, O. Oralkan*, I. Wygant*, M. O'Donnell* & B. Khuri-Yakub*

co-author countries: United States of America 🇺🇸

Event: IEEE Ultrasonics Symposium, 2005.

Sources: Crossref, ORCID
Added: March 30, 2019

2006 conference paper

Through-wafer trench-isolated electrical interconnects for CMUT arrays

IEEE Ultrasonics Symposium, 2005. Presented at the IEEE Ultrasonics Symposium, 2005.

By: X. Zhuang*, A. Ergun*, O. Oralkan*, Y. Huang*, I. Wygant*, G. Yaralioglu*, D. Yeh*, B. Khuri-Yakub*

co-author countries: United States of America 🇺🇸

Event: IEEE Ultrasonics Symposium, 2005.

Sources: Crossref, ORCID
Added: March 30, 2019

2006 conference paper

Characterization of cross-coupling in capacitive micromachined ultrasonic transducers

IEEE Ultrasonics Symposium, 2005. Presented at the IEEE Ultrasonics Symposium, 2005.

By: B. Bayram*, M. Kupnik*, G. Yaralioglu*, O. Oralkan*, D. Lin*, X. Zhuang*, A. Ergun*, A. Sarioglu* ...

co-author countries: United States of America 🇺🇸

Event: IEEE Ultrasonics Symposium, 2005.

Sources: Crossref, ORCID
Added: March 30, 2019

2006 conference paper

Interconnection and Packaging for 2D Capacitive Micromachined Ultrasonic Transducer Arrays Based on Through-Wafer Trench Isolation

19th IEEE International Conference on Micro Electro Mechanical Systems. Presented at the 19th IEEE International Conference on Micro Electro Mechanical Systems.

By: X. Zhuang*, A. Ergun*, O. Oralkan*, I. Wygant* & B. Khuri-Yakub*

co-author countries: United States of America 🇺🇸

Event: 19th IEEE International Conference on Micro Electro Mechanical Systems

Sources: Crossref, ORCID
Added: March 30, 2019

2006 conference paper

Capacitive micromachined ultrasonic transducers (CMUTs) for photoacoustic imaging

In A. A. Oraevsky & L. V. Wang (Eds.), Photons Plus Ultrasound: Imaging and Sensing 2006: The Seventh Conference on Biomedical Thermoacoustics, Optoacoustics, and Acousto-optics.

By: S. Vaithilingam*, I. Wygant*, P. Kuo*, X. Zhuang*, Ö. Oralkan*, P. Olcott*, B. Khuri-Yakub*

co-author countries: United States of America 🇺🇸

Ed(s): A. Oraevsky & L. Wang

Event: Biomedical Optics 2006

author keywords: CMUT; high-frequency; laser; ultrasound; photoacoustic; optoacoustic; integrated electronics; imaging
Sources: Crossref, ORCID
Added: March 30, 2019

2006 conference paper

Beamforming and hardware design for a multichannel front-end integrated circuit for real-time 3D catheter-based ultrasonic imaging

In S. Emelianov & W. F. Walker (Eds.), Medical Imaging 2006: Ultrasonic Imaging and Signal Processing.

co-author countries: Türkiye 🇹🇷 United States of America 🇺🇸

Ed(s): S. Emelianov & W. Walker

Event: Medical Imaging

author keywords: ultrasound; imaging; 3D; volumetric; beamforming; CMUT; integration; electronics
Sources: Crossref, ORCID
Added: March 30, 2019

2006 conference paper

5I-6 Finite Element Analysis of Fabrication Related Thermal Effects in Capacitive Micromachined Ultrasonic Transducers

2006 IEEE Ultrasonics Symposium. Presented at the 2006 IEEE Ultrasonics Symposium.

By: B. Khuri-Yakub*, G. Yaralioglu*, B. Bayram*, M. Kupnik*, S. Wong*, A. Ergun*, O. Oralkan*, D. Lin*

co-author countries: United States of America 🇺🇸

Event: 2006 IEEE Ultrasonics Symposium

Sources: Crossref, ORCID
Added: March 30, 2019

2006 conference paper

1I-2 Capacitive Micromachined Ultrasonic Transducers for High Intensity Focused Ablation of Upper Abdominal Tumors

2006 IEEE Ultrasonics Symposium. Presented at the 2006 IEEE Ultrasonics Symposium.

By: X. Zhuang*, B. Khuri-Yakub*, G. Yaralioglu*, M. Kupnik*, O. Oralkan*, S. Wong*, A. Ergun*, K. Butts-Pauly*

co-author countries: United States of America 🇺🇸

Event: 2006 IEEE Ultrasonics Symposium

Sources: Crossref, ORCID
Added: March 30, 2019

2006 conference paper

P3H-7 Volumetric Imaging Using Fan-Beam Scanning with Reduced Redundancy 2D Arrays

2006 IEEE Ultrasonics Symposium. Presented at the 2006 IEEE Ultrasonics Symposium.

By: B. Khuri-Yakub*, M. Karaman*, O. Oralkan* & I. Wygant*

co-author countries: Türkiye 🇹🇷 United States of America 🇺🇸

Event: 2006 IEEE Ultrasonics Symposium

Sources: Crossref, ORCID
Added: March 30, 2019

2006 conference paper

P3H-6 An Integrated Circuit with Transmit Beamforming and Parallel Receive Channels for Real-Time Three-Dimensional Ultrasound Imaging

2006 IEEE Ultrasonics Symposium. Presented at the 2006 IEEE Ultrasonics Symposium.

By: B. Khuri-Yakub*, M. Karaman*, O. Oralkan*, A. Nikoozadeh*, I. Wygant*, H. Lee*, D. Yeh*

co-author countries: Türkiye 🇹🇷 United States of America 🇺🇸

Event: 2006 IEEE Ultrasonics Symposium

Sources: Crossref, ORCID
Added: March 30, 2019

2006 conference paper

Differential current-mode signaling for robust and power efficient on-chip global interconnects

IEEE 14th Topical Meeting on Electrical Performance of Electronic Packaging, 2005. Presented at the IEEE 14th Topical Meeting on Electrical Performance of Electronic Packaging, 2005.

By: L. Zhang n, J. Wilson n, R. Bashirullah n & P. Franzon n

co-author countries: United States of America 🇺🇸

Event: IEEE 14th Topical Meeting on Electrical Performance of Electronic Packaging, 2005.

Sources: Crossref, ORCID
Added: March 24, 2019

2006 conference paper

Signal integrity and robustness of ACCI packaged systems

IEEE 14th Topical Meeting on Electrical Performance of Electronic Packaging, 2005. Presented at the IEEE 14th Topical Meeting on Electrical Performance of Electronic Packaging, 2005.

By: L. Luo n, J. Wilson n, J. Xu n, S. Mick n & P. Franzon n

co-author countries: United States of America 🇺🇸

Event: IEEE 14th Topical Meeting on Electrical Performance of Electronic Packaging, 2005.

Sources: Crossref, ORCID
Added: March 24, 2019

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