College of Engineering
Displaying works 101 - 120 of 328 in total
Sorted by most recent date added to the index first, which may not be the same as publication date order.
2010 chapter
Unit Commitment Considering Generation Flexibility and Environmental Constraints
In Ieee Power and Energy Society General Meeting 2010. http://gateway.webofknowledge.com/gateway/Gateway.cgi?GWVersion=2&SrcAuth=ORCID&SrcApp=OrcidOrg&DestLinkType=FullRecord&DestApp=WOS_CPL&KeyUT=WOS:000287611905101&KeyUID=WOS:000287611905101
2010 journal article
Smart-Grid Security Issues
Ieee Security & Privacy, 8(1), 81–85.
2010 journal article
Climate Change Impacts on Residential and Commercial Loads in the Western US Grid
Ieee Transactions on Power Systems, 25(1), 480–488.
2010 chapter
An Evaluation of the Flywheel Potential for Providing Regulation Service in California
In Ieee Power and Energy Society General Meeting 2010. http://gateway.webofknowledge.com/gateway/Gateway.cgi?GWVersion=2&SrcAuth=ORCID&SrcApp=OrcidOrg&DestLinkType=FullRecord&DestApp=WOS_CPL&KeyUT=WOS:000287611901134&KeyUID=WOS:000287611901134
2010 conference paper
Packaging of large and low-pitch size 2D ultrasonic transducer arrays
Proceedings of the 2010 IEEE 23rd International Conference on Micro Electro Mechanical Systems (MEMS), 508–511.
Event: 23rd IEEE International Conference on Micro Electro Mechanical Systems (MEMS 2010)
2010 conference paper
Thermal Investigatoin of Tier Swapping to Improve the Thermal Profile of Memory-on-Logic 3DICs
IEEE THERMINIC, 1–6.
2010 conference paper
The NCSU Tezzaron design kit
2010 IEEE International 3D Systems Integration Conference (3DIC), 1–15.
Event: 2010 IEEE International 3D Systems Integration Conference (3DIC)
2010 conference paper
Creating 3D specific systems: Architecture, design and CAD
2010 Design, Automation & Test in Europe Conference & Exhibition (DATE 2010), 1684–1688.
Event: 2010 Design, Automation & Test in Europe Conference & Exhibition (DATE 2010) at Dresden, Germany on March 8-12, 2010
2010 conference paper
A zero power consumption Multi-Capacitor structure for voltage summing in high-speed FFE
19th Topical Meeting on Electrical Performance of Electronic Packaging and Systems. Presented at the 2010 IEEE 19th Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS).
Event: 2010 IEEE 19th Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS)
2010 conference paper
Logic-on-logic 3D integration and placement
2010 IEEE International 3D Systems Integration Conference (3DIC). Presented at the 2010 IEEE International 3D Systems Integration Conference (3DIC).
Event: 2010 IEEE International 3D Systems Integration Conference (3DIC)
2010 conference paper
Thermal isolation in 3D chip stacks using vacuum gaps and capacitive or inductive communications
2010 IEEE International 3D Systems Integration Conference (3DIC). Presented at the 2010 IEEE International 3D Systems Integration Conference (3DIC).
Event: 2010 IEEE International 3D Systems Integration Conference (3DIC)
2010 conference paper
Miniaturized ultrasound imaging probes enabled by CMUT arrays with integrated frontend electronic circuits
2010 Annual International Conference of the IEEE Engineering in Medicine and Biology. Presented at the 2010 32nd Annual International Conference of the IEEE Engineering in Medicine and Biology Society (EMBC 2010).
Event: 2010 32nd Annual International Conference of the IEEE Engineering in Medicine and Biology Society (EMBC 2010)
2010 conference paper
Simulating capacitive micromachined ultrasonic transducers (CMUTs) using field II
2010 IEEE International Ultrasonics Symposium. Presented at the 2010 International Ultrasonics Symposium.
Event: 2010 International Ultrasonics Symposium
2010 conference paper
Monitoring radiofrequency catheter ablation using thermal strain imaging
2010 IEEE International Ultrasonics Symposium. Presented at the 2010 IEEE Ultrasonics Symposium (IUS).
Event: 2010 IEEE Ultrasonics Symposium (IUS)
2010 conference paper
Design optimization for a 2-D sparse transducer array for 3-D ultrasound imaging
2010 IEEE International Ultrasonics Symposium. Presented at the 2010 IEEE Ultrasonics Symposium (IUS).
Event: 2010 IEEE Ultrasonics Symposium (IUS)
2010 conference paper
3-D Deep penetration photoacoustic imaging with a 2-D CMUT array
2010 IEEE International Ultrasonics Symposium. Presented at the 2010 IEEE Ultrasonics Symposium (IUS).
Event: 2010 IEEE Ultrasonics Symposium (IUS)
2010 conference paper
Forward-looking intracardiac imaging catheters using fully integrated CMUT arrays
2010 IEEE International Ultrasonics Symposium. Presented at the 2010 IEEE Ultrasonics Symposium (IUS).
Event: 2010 IEEE Ultrasonics Symposium (IUS)
2010 conference paper
Ultrasound compatible RF ablation electrode design for catheter based guidance of RF ablation — In vivo results with thermal strain imaging
2010 IEEE International Ultrasonics Symposium. Presented at the 2010 International Ultrasonics Symposium.
Event: 2010 International Ultrasonics Symposium
2010 conference paper
Highly sensitive detection of DMMP using a CMUT-based chemical sensor
2010 IEEE Sensors. Presented at the 2010 Ninth IEEE Sensors Conference (SENSORS 2010).
Event: 2010 Ninth IEEE Sensors Conference (SENSORS 2010)
2010 conference paper
Zero-bias resonant sensor with an oxide-nitride layer as charge trap
2010 IEEE Sensors. Presented at the 2010 Ninth IEEE Sensors Conference (SENSORS 2010).
Event: 2010 Ninth IEEE Sensors Conference (SENSORS 2010)