Works Published in 2010
Displaying works 101 - 120 of 333 in total
Sorted by most recent date added to the index first, which may not be the same as publication date order.
2010 conference paper
EXACT: Explicit Dynamic-Branch Prediction with Active Updates
Proceedings of the 7th ACM international conference on Computing frontiers - CF '10, 165–176.
co-author countries:
United States of America 🇺🇸
Event: the 7th ACM international conference
author keywords: branch prediction; superscalar processors; microarchitecture
Source: Crossref
Added: July 28, 2019
2010 journal article
A Numerical Study of the Bottom-Up and Top-Down Inference Processes in And-Or Graphs
International Journal of Computer Vision, 93(2), 226–252.
co-author countries:
United States of America 🇺🇸
author keywords: Bottom-up/Top-down inference; a-beta-gamma process; Information contribution; Hierarchical model; And-Or graph; Object parsing
citeseerx.ist.psu.edu (repository)
Sources: Crossref, ORCID
Added: July 20, 2019
2010 journal article
Statistical Feature Selection From Massive Data in Distribution Fault Diagnosis
IEEE Transactions on Power Systems, 25(2), 642–648.
co-author countries:
United States of America 🇺🇸
author keywords: Akaike's information criteria; classification; fault cause identification; feature selection; hypothesis test; LASSO; logistic regression; power distribution systems; smart grid; stepwise regression
Source: Crossref
Added: June 20, 2019
2010 report
THE WIDE-AREA ENERGY STORAGE AND MANAGEMENT SYSTEM PHASE II Final Report - Flywheel Field Tests
Sources: Crossref, ORCID
Added: June 6, 2019
2010 report
The Wide-area Energy Management System Phase 2 Final Report
Sources: Crossref, ORCID
Added: June 6, 2019
2010 chapter
Unit Commitment Considering Generation Flexibility and Environmental Constraints
In Ieee Power and Energy Society General Meeting 2010. http://gateway.webofknowledge.com/gateway/Gateway.cgi?GWVersion=2&SrcAuth=ORCID&SrcApp=OrcidOrg&DestLinkType=FullRecord&DestApp=WOS_CPL&KeyUT=WOS:000287611905101&KeyUID=WOS:000287611905101
Contributors: S. Lu, Y. Makarov, Y. Zhu, N. Lu , N. Kumar, B. Chakrabarti, . Ieee
Source: ORCID
Added: May 6, 2019
2010 journal article
Smart-Grid Security Issues
Ieee Security & Privacy, 8(1), 81–85.
co-author countries:
United States of America 🇺🇸
Contributors: H. Khurana*, M. Hadley*, N. Lu & D. Frincke*
Source: ORCID
Added: May 6, 2019
2010 journal article
Climate Change Impacts on Residential and Commercial Loads in the Western US Grid
Ieee Transactions on Power Systems, 25(1), 480–488.
co-author countries:
United States of America 🇺🇸
Contributors: N. Lu , T. Taylor*, W. Jiang *, C. Jin*, J. Correia*, L. Leung*, P. Wong*
author keywords: Climate change; commercial load; fault-induced delayed voltage recovery; load composition; load modeling; power system stability; residential load; temperature sensitivity
Source: ORCID
Added: May 6, 2019
2010 chapter
An Evaluation of the Flywheel Potential for Providing Regulation Service in California
In Ieee Power and Energy Society General Meeting 2010. http://gateway.webofknowledge.com/gateway/Gateway.cgi?GWVersion=2&SrcAuth=ORCID&SrcApp=OrcidOrg&DestLinkType=FullRecord&DestApp=WOS_CPL&KeyUT=WOS:000287611901134&KeyUID=WOS:000287611901134
Contributors: N. Lu , M. Weimar, Y. Makarov, F. Rudolph, S. Murthy, J. Arseneaux, C. Loutan, . Ieee
Source: ORCID
Added: May 6, 2019
2010 conference paper
Packaging of large and low-pitch size 2D ultrasonic transducer arrays
Proceedings of the 2010 IEEE 23rd International Conference on Micro Electro Mechanical Systems (MEMS), 508–511.
co-author countries:
United States of America 🇺🇸
Event: 23rd IEEE International Conference on Micro Electro Mechanical Systems (MEMS 2010)
Sources: Crossref, ORCID
Added: April 24, 2019
2010 conference paper
Thermal Investigatoin of Tier Swapping to Improve the Thermal Profile of Memory-on-Logic 3DICs
IEEE THERMINIC, 1–6.
Source: NC State University Libraries
Added: April 11, 2019
2010 conference paper
The NCSU Tezzaron design kit
2010 IEEE International 3D Systems Integration Conference (3DIC), 1–15.
Event: 2010 IEEE International 3D Systems Integration Conference (3DIC)
Sources: Crossref, ORCID
Added: April 11, 2019
2010 conference paper
Creating 3D specific systems: Architecture, design and CAD
2010 Design, Automation & Test in Europe Conference & Exhibition (DATE 2010), 1684–1688.
co-author countries:
United States of America 🇺🇸
Event: 2010 Design, Automation & Test in Europe Conference & Exhibition (DATE 2010) at Dresden, Germany on March 8-12, 2010
Sources: Crossref, ORCID, NC State University Libraries
Added: March 24, 2019
2010 conference paper
A zero power consumption Multi-Capacitor structure for voltage summing in high-speed FFE
19th Topical Meeting on Electrical Performance of Electronic Packaging and Systems. Presented at the 2010 IEEE 19th Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS).
co-author countries:
United States of America 🇺🇸
Event: 2010 IEEE 19th Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS)
Sources: Crossref, ORCID
Added: March 24, 2019
2010 conference paper
Logic-on-logic 3D integration and placement
2010 IEEE International 3D Systems Integration Conference (3DIC). Presented at the 2010 IEEE International 3D Systems Integration Conference (3DIC).
co-author countries:
United States of America 🇺🇸
Event: 2010 IEEE International 3D Systems Integration Conference (3DIC)
Sources: Crossref, ORCID
Added: March 24, 2019
2010 conference paper
Thermal isolation in 3D chip stacks using vacuum gaps and capacitive or inductive communications
2010 IEEE International 3D Systems Integration Conference (3DIC). Presented at the 2010 IEEE International 3D Systems Integration Conference (3DIC).
co-author countries:
United States of America 🇺🇸
Event: 2010 IEEE International 3D Systems Integration Conference (3DIC)
Sources: Crossref, ORCID
Added: March 24, 2019
2010 conference paper
Miniaturized ultrasound imaging probes enabled by CMUT arrays with integrated frontend electronic circuits
2010 Annual International Conference of the IEEE Engineering in Medicine and Biology. Presented at the 2010 32nd Annual International Conference of the IEEE Engineering in Medicine and Biology Society (EMBC 2010).
co-author countries:
United States of America 🇺🇸
Event: 2010 32nd Annual International Conference of the IEEE Engineering in Medicine and Biology Society (EMBC 2010)
MeSH headings : Animals; Catheterization; Electrocardiography; Electronics, Medical / instrumentation; Imaging, Three-Dimensional / instrumentation; Microtechnology / instrumentation; Phantoms, Imaging; Sus scrofa; Transducers; Ultrasonics / instrumentation
Sources: Crossref, ORCID
Added: March 24, 2019
2010 conference paper
Simulating capacitive micromachined ultrasonic transducers (CMUTs) using field II
2010 IEEE International Ultrasonics Symposium. Presented at the 2010 International Ultrasonics Symposium.
co-author countries:
Denmark 🇩🇰 United States of America 🇺🇸
Event: 2010 International Ultrasonics Symposium
Sources: Crossref, ORCID
Added: March 24, 2019
2010 conference paper
Monitoring radiofrequency catheter ablation using thermal strain imaging
2010 IEEE International Ultrasonics Symposium. Presented at the 2010 IEEE Ultrasonics Symposium (IUS).
co-author countries:
United States of America 🇺🇸
Event: 2010 IEEE Ultrasonics Symposium (IUS)
Sources: Crossref, ORCID
Added: March 24, 2019
2010 conference paper
Design optimization for a 2-D sparse transducer array for 3-D ultrasound imaging
2010 IEEE International Ultrasonics Symposium. Presented at the 2010 IEEE Ultrasonics Symposium (IUS).
co-author countries:
United States of America 🇺🇸
Event: 2010 IEEE Ultrasonics Symposium (IUS)
Sources: Crossref, ORCID
Added: March 24, 2019
