Electrical and Computer Engineering

Works Published in 2010

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Displaying works 101 - 120 of 333 in total

Sorted by most recent date added to the index first, which may not be the same as publication date order.

2010 conference paper

EXACT: Explicit Dynamic-Branch Prediction with Active Updates

Proceedings of the 7th ACM international conference on Computing frontiers - CF '10, 165โ€“176.

By: M. Al-Otoom n, E. Forbes n & E. Rotenberg n

co-author countries: United States of America ๐Ÿ‡บ๐Ÿ‡ธ

Event: the 7th ACM international conference

author keywords: branch prediction; superscalar processors; microarchitecture
Source: Crossref
Added: July 28, 2019

2010 journal article

A Numerical Study of the Bottom-Up and Top-Down Inference Processes in And-Or Graphs

International Journal of Computer Vision, 93(2), 226โ€“252.

By: T. Wu*โ€‰ & S. Zhuโ€‰*

co-author countries: United States of America ๐Ÿ‡บ๐Ÿ‡ธ
author keywords: Bottom-up/Top-down inference; a-beta-gamma process; Information contribution; Hierarchical model; And-Or graph; Object parsing
Sources: Crossref, ORCID
Added: July 20, 2019

2010 journal article

Statistical Feature Selection From Massive Data in Distribution Fault Diagnosis

IEEE Transactions on Power Systems, 25(2), 642โ€“648.

co-author countries: United States of America ๐Ÿ‡บ๐Ÿ‡ธ
author keywords: Akaike's information criteria; classification; fault cause identification; feature selection; hypothesis test; LASSO; logistic regression; power distribution systems; smart grid; stepwise regression
Source: Crossref
Added: June 20, 2019

2010 report

THE WIDE-AREA ENERGY STORAGE AND MANAGEMENT SYSTEM PHASE II Final Report - Flywheel Field Tests

By: N. Luโ€‰, Y. Makarov, M. Weimar, F. Rudolph, S. Murthy, J. Arseneaux, C. Loutan, S. Chowdhury

Sources: Crossref, ORCID
Added: June 6, 2019

2010 report

The Wide-area Energy Management System Phase 2 Final Report

By: N. Luโ€‰, Y. Makarov & M. Weimar

Sources: Crossref, ORCID
Added: June 6, 2019

2010 chapter

Unit Commitment Considering Generation Flexibility and Environmental Constraints

In Ieee Power and Energy Society General Meeting 2010. http://gateway.webofknowledge.com/gateway/Gateway.cgi?GWVersion=2&SrcAuth=ORCID&SrcApp=OrcidOrg&DestLinkType=FullRecord&DestApp=WOS_CPL&KeyUT=WOS:000287611905101&KeyUID=WOS:000287611905101

By: S. Lu, Y. Makarov, Y. Zhu, N. Luโ€‰, N. Kumar, B. Chakrabarti, Ieee

Contributors: S. Lu, Y. Makarov, Y. Zhu, N. Luโ€‰, N. Kumar, B. Chakrabarti, . Ieee

Source: ORCID
Added: May 6, 2019

2010 journal article

Smart-Grid Security Issues

Ieee Security & Privacy, 8(1), 81โ€“85.

By: H. Khurana*, M. Hadley*, N. Luโ€‰ & D. Frincke*

co-author countries: United States of America ๐Ÿ‡บ๐Ÿ‡ธ

Contributors: H. Khurana*, M. Hadley*, N. Luโ€‰ & D. Frincke*

Source: ORCID
Added: May 6, 2019

2010 journal article

Climate Change Impacts on Residential and Commercial Loads in the Western US Grid

Ieee Transactions on Power Systems, 25(1), 480โ€“488.

By: N. Luโ€‰, T. Taylor*, W. Jiangโ€‰*, C. Jin*, J. Correia*, L. Leung*, P. Wong*

co-author countries: United States of America ๐Ÿ‡บ๐Ÿ‡ธ

Contributors: N. Luโ€‰, T. Taylor*, W. Jiangโ€‰*, C. Jin*, J. Correia*, L. Leung*, P. Wong*

author keywords: Climate change; commercial load; fault-induced delayed voltage recovery; load composition; load modeling; power system stability; residential load; temperature sensitivity
Source: ORCID
Added: May 6, 2019

2010 chapter

An Evaluation of the Flywheel Potential for Providing Regulation Service in California

In Ieee Power and Energy Society General Meeting 2010. http://gateway.webofknowledge.com/gateway/Gateway.cgi?GWVersion=2&SrcAuth=ORCID&SrcApp=OrcidOrg&DestLinkType=FullRecord&DestApp=WOS_CPL&KeyUT=WOS:000287611901134&KeyUID=WOS:000287611901134

By: N. Luโ€‰, M. Weimar, Y. Makarov, F. Rudolph, S. Murthy, J. Arseneaux, C. Loutan, Ieee

Contributors: N. Luโ€‰, M. Weimar, Y. Makarov, F. Rudolph, S. Murthy, J. Arseneaux, C. Loutan, . Ieee

Source: ORCID
Added: May 6, 2019

2010 conference paper

Packaging of large and low-pitch size 2D ultrasonic transducer arrays

Proceedings of the 2010 IEEE 23rd International Conference on Micro Electro Mechanical Systems (MEMS), 508โ€“511.

co-author countries: United States of America ๐Ÿ‡บ๐Ÿ‡ธ

Event: 23rd IEEE International Conference on Micro Electro Mechanical Systems (MEMS 2010)

Sources: Crossref, ORCID
Added: April 24, 2019

2010 conference paper

Thermal Investigatoin of Tier Swapping to Improve the Thermal Profile of Memory-on-Logic 3DICs

IEEE THERMINIC, 1โ€“6.

By: S. Melamed, T. Thorolfsson, A. Srinivasan, E. Cheng, P. Franozn & W. Davis

Source: NC State University Libraries
Added: April 11, 2019

2010 conference paper

The NCSU Tezzaron design kit

2010 IEEE International 3D Systems Integration Conference (3DIC), 1โ€“15.

By: S. Lipa, T. Thorolfsson & P. Franzon*โ€‰

Event: 2010 IEEE International 3D Systems Integration Conference (3DIC)

Sources: Crossref, ORCID
Added: April 11, 2019

2010 conference paper

Creating 3D specific systems: Architecture, design and CAD

2010 Design, Automation & Test in Europe Conference & Exhibition (DATE 2010), 1684โ€“1688.

By: P. Franzon nโ€‰, W. Davis n & T. Thorolffson n

co-author countries: United States of America ๐Ÿ‡บ๐Ÿ‡ธ

Event: 2010 Design, Automation & Test in Europe Conference & Exhibition (DATE 2010) at Dresden, Germany on March 8-12, 2010

Sources: Crossref, ORCID, NC State University Libraries
Added: March 24, 2019

2010 conference paper

A zero power consumption Multi-Capacitor structure for voltage summing in high-speed FFE

19th Topical Meeting on Electrical Performance of Electronic Packaging and Systems. Presented at the 2010 IEEE 19th Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS).

By: B. Su n, W. Pitts n, P. Franzon nโ€‰ & J. Wilsonโ€‰ n

co-author countries: United States of America ๐Ÿ‡บ๐Ÿ‡ธ

Event: 2010 IEEE 19th Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS)

Sources: Crossref, ORCID
Added: March 24, 2019

2010 conference paper

Logic-on-logic 3D integration and placement

2010 IEEE International 3D Systems Integration Conference (3DIC). Presented at the 2010 IEEE International 3D Systems Integration Conference (3DIC).

By: T. Thorolfsson n, G. Luoโ€‰*, J. Congโ€‰* & P. Franzon nโ€‰

co-author countries: United States of America ๐Ÿ‡บ๐Ÿ‡ธ

Event: 2010 IEEE International 3D Systems Integration Conference (3DIC)

Sources: Crossref, ORCID
Added: March 24, 2019

2010 conference paper

Thermal isolation in 3D chip stacks using vacuum gaps and capacitive or inductive communications

2010 IEEE International 3D Systems Integration Conference (3DIC). Presented at the 2010 IEEE International 3D Systems Integration Conference (3DIC).

co-author countries: United States of America ๐Ÿ‡บ๐Ÿ‡ธ

Event: 2010 IEEE International 3D Systems Integration Conference (3DIC)

Sources: Crossref, ORCID
Added: March 24, 2019

2010 conference paper

Miniaturized ultrasound imaging probes enabled by CMUT arrays with integrated frontend electronic circuits

2010 Annual International Conference of the IEEE Engineering in Medicine and Biology. Presented at the 2010 32nd Annual International Conference of the IEEE Engineering in Medicine and Biology Society (EMBC 2010).

By: B. Khuri-Yakubโ€‰*, O. Oralkan*โ€‰, A. Nikoozadeh*, I. Wygant*, S. Zhuang*, M. Gencel*, J. Choe*, D. Stephens* ...

co-author countries: United States of America ๐Ÿ‡บ๐Ÿ‡ธ

Event: 2010 32nd Annual International Conference of the IEEE Engineering in Medicine and Biology Society (EMBC 2010)

MeSH headings : Animals; Catheterization; Electrocardiography; Electronics, Medical / instrumentation; Imaging, Three-Dimensional / instrumentation; Microtechnology / instrumentation; Phantoms, Imaging; Sus scrofa; Transducers; Ultrasonics / instrumentation
Sources: Crossref, ORCID
Added: March 24, 2019

2010 conference paper

Simulating capacitive micromachined ultrasonic transducers (CMUTs) using field II

2010 IEEE International Ultrasonics Symposium. Presented at the 2010 International Ultrasonics Symposium.

co-author countries: Denmark ๐Ÿ‡ฉ๐Ÿ‡ฐ United States of America ๐Ÿ‡บ๐Ÿ‡ธ

Event: 2010 International Ultrasonics Symposium

Sources: Crossref, ORCID
Added: March 24, 2019

2010 conference paper

Monitoring radiofrequency catheter ablation using thermal strain imaging

2010 IEEE International Ultrasonics Symposium. Presented at the 2010 IEEE Ultrasonics Symposium (IUS).

By: C. Seo*, D. Stephens*, J. Cannata*, A. Dentinger*, F. Lin, S. Park, D. Wildes*, K. Thomenius* ...

co-author countries: United States of America ๐Ÿ‡บ๐Ÿ‡ธ

Event: 2010 IEEE Ultrasonics Symposium (IUS)

Sources: Crossref, ORCID
Added: March 24, 2019

2010 conference paper

Design optimization for a 2-D sparse transducer array for 3-D ultrasound imaging

2010 IEEE International Ultrasonics Symposium. Presented at the 2010 IEEE Ultrasonics Symposium (IUS).

By: J. Choe*, O. Oralkan*โ€‰ & P. Khuri-Yakub*

co-author countries: United States of America ๐Ÿ‡บ๐Ÿ‡ธ

Event: 2010 IEEE Ultrasonics Symposium (IUS)

Sources: Crossref, ORCID
Added: March 24, 2019