Electrical & Computer Engineering

Unit Commitment Considering Generation Flexibility and Environmental Constraints

In Ieee Power and Energy Society General Meeting 2010. http://gateway.webofknowledge.com/gateway/Gateway.cgi?GWVersion=2&SrcAuth=ORCID&SrcApp=OrcidOrg&DestLinkType=FullRecord&DestApp=WOS_CPL&KeyUT=WOS:000287611905101&KeyUID=WOS:000287611905101

Smart-Grid Security Issues

Ieee Security & Privacy, 8(1), 81–85.

Climate Change Impacts on Residential and Commercial Loads in the Western US Grid

Ieee Transactions on Power Systems, 25(1), 480–488.

An Evaluation of the Flywheel Potential for Providing Regulation Service in California

In Ieee Power and Energy Society General Meeting 2010. http://gateway.webofknowledge.com/gateway/Gateway.cgi?GWVersion=2&SrcAuth=ORCID&SrcApp=OrcidOrg&DestLinkType=FullRecord&DestApp=WOS_CPL&KeyUT=WOS:000287611901134&KeyUID=WOS:000287611901134

Packaging of large and low-pitch size 2D ultrasonic transducer arrays

Proceedings of the 2010 IEEE 23rd International Conference on Micro Electro Mechanical Systems (MEMS), 508–511.

Thermal Investigatoin of Tier Swapping to Improve the Thermal Profile of Memory-on-Logic 3DICs

IEEE THERMINIC, 1–6.

The NCSU Tezzaron design kit

2010 IEEE International 3D Systems Integration Conference (3DIC), 1–15.

Creating 3D specific systems: Architecture, design and CAD

2010 Design, Automation & Test in Europe Conference & Exhibition (DATE 2010), 1684–1688.

A zero power consumption Multi-Capacitor structure for voltage summing in high-speed FFE

19th Topical Meeting on Electrical Performance of Electronic Packaging and Systems. Presented at the 2010 IEEE 19th Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS).

Logic-on-logic 3D integration and placement

2010 IEEE International 3D Systems Integration Conference (3DIC). Presented at the 2010 IEEE International 3D Systems Integration Conference (3DIC).

Thermal isolation in 3D chip stacks using vacuum gaps and capacitive or inductive communications

2010 IEEE International 3D Systems Integration Conference (3DIC). Presented at the 2010 IEEE International 3D Systems Integration Conference (3DIC).

Miniaturized ultrasound imaging probes enabled by CMUT arrays with integrated frontend electronic circuits

2010 Annual International Conference of the IEEE Engineering in Medicine and Biology. Presented at the 2010 32nd Annual International Conference of the IEEE Engineering in Medicine and Biology Society (EMBC 2010).

Simulating capacitive micromachined ultrasonic transducers (CMUTs) using field II

2010 IEEE International Ultrasonics Symposium. Presented at the 2010 International Ultrasonics Symposium.

Monitoring radiofrequency catheter ablation using thermal strain imaging

2010 IEEE International Ultrasonics Symposium. Presented at the 2010 IEEE Ultrasonics Symposium (IUS).

Design optimization for a 2-D sparse transducer array for 3-D ultrasound imaging

2010 IEEE International Ultrasonics Symposium. Presented at the 2010 IEEE Ultrasonics Symposium (IUS).

3-D Deep penetration photoacoustic imaging with a 2-D CMUT array

2010 IEEE International Ultrasonics Symposium. Presented at the 2010 IEEE Ultrasonics Symposium (IUS).

Forward-looking intracardiac imaging catheters using fully integrated CMUT arrays

2010 IEEE International Ultrasonics Symposium. Presented at the 2010 IEEE Ultrasonics Symposium (IUS).

Ultrasound compatible RF ablation electrode design for catheter based guidance of RF ablation — In vivo results with thermal strain imaging

2010 IEEE International Ultrasonics Symposium. Presented at the 2010 International Ultrasonics Symposium.

Highly sensitive detection of DMMP using a CMUT-based chemical sensor

2010 IEEE Sensors. Presented at the 2010 Ninth IEEE Sensors Conference (SENSORS 2010).

Zero-bias resonant sensor with an oxide-nitride layer as charge trap

2010 IEEE Sensors. Presented at the 2010 Ninth IEEE Sensors Conference (SENSORS 2010).