Materials Science and Engineering

Electroplasticity in metals and ceramics

Conrad, H. (2000, August 15). MATERIALS SCIENCE AND ENGINEERING A-STRUCTURAL MATERIALS PROPERTIES MICROSTRUCTURE AND PROCESSING, Vol. 287, pp. 276–287.

Temperature-induced morphological evolution in polymer blends produced by cryogenic mechanical alloying

Macromolecular Materials and Engineering, 274(1), 1–12.

Quantum confinement of E-1 and E-2 transitions in Ge quantum dots embedded in an Al2O3 or an AlN matrix

APPLIED PHYSICS LETTERS, 76(1), 43–45.

Planarization processes and applications III. As-deposited and annealed film properties

JOURNAL OF THE ELECTROCHEMICAL SOCIETY, 147(4), 1513–1524.

Photoluminescence and recombination mechanisms in GaN/Al0.2Ga0.8N superlattice

APPLIED PHYSICS LETTERS, 76(15), 1969–1971.

Mode Gruneisen parameters and negative thermal expansion of cubic ZrW2O8 and ZrMo2O8

APPLIED PHYSICS LETTERS, 76(16), 2203–2204.

Lattice parameters and thermal expansion of GaN

JOURNAL OF MATERIALS RESEARCH, 15(1), 40–44.

Influence of Pt heterostructure bottom electrodes on SrBi2Ta2O9 thin film properties

APPLIED PHYSICS LETTERS, 76(4), 496–498.

Deposition and characterization of undoped and boron and phosphorus doped (SixGe1-xO2) glass films

JOURNAL OF THE ELECTROCHEMICAL SOCIETY, 147(4), 1560–1567.

Cryogenic mechanical alloying of poly(methyl methacrylate) with polyisoprene and poly(ethylene-alt-propylene)

MACROMOLECULES, 33(7), 2595–2604.

Selective area chemical vapor deposition of Si1-xGex thin film alloys by the alternating cyclic method: Experimental data II. Morphology and composition as a function of deposition parameters

JOURNAL OF THE ELECTROCHEMICAL SOCIETY, 147(5), 1854–1858.

Selective area chemical vapor deposition of Si1-xGex thin film alloys by the alternating cyclic method: Experimental data I. Deposition parameters

JOURNAL OF THE ELECTROCHEMICAL SOCIETY, 147(5), 1847–1853.

Secondary ion mass spectrometry depth profiling of ultrashallow phosphorous in silicon

JOURNAL OF VACUUM SCIENCE & TECHNOLOGY B, Vol. 18, pp. 509–513.

Model acrylate-terminated urethane blends in toughened epoxies: a morphology and stress relaxation study

POLYMER, 41(16), 6341–6349.

High-energy mechanical milling of poly(methyl methacrylate), polyisoprene and poly(ethylene-alt-propylene)

POLYMER, 41(16), 6271–6283.

Deformation mechanisms in tin and tin-based electronic solder alloys

CREEP AND FRACTURE OF ENGINEERING MATERIALS AND STRUCTURES, Vol. 171-1, pp. 655–662.

Atomistic modeling of the fracture of polycrystalline diamond

PHYSICAL REVIEW B, 61(6), 3877–3888.

Ultrathin DLC and SiOx layer deposition on poly(ethylene terephthalate) and restriction of surface dynamics

Journal of Applied Polymer Science, 75(9), 1158–1164.

Spatial variation of ferroelectric properties in Pb(Zr-0.3, Ti-0.7)O-3 thin films studied by atomic force microscopy

JOURNAL OF APPLIED PHYSICS, 87(11), 8031–8034.

Morphology and gas barrier properties of thin SiOx coatings on polycarbonate: Correlations with plasma-enhanced chemical vapor deposition conditions

JOURNAL OF MATERIALS RESEARCH, 15(3), 704–717.