Electrical & Computer Engineering

Flexible structure for wavelet packet-based subband adaptive equalization

Proceedings of the IEEE-SP International Symposium on Time-Frequency and Time-Scale Analysis, 377–380. http://www.scopus.com/inward/record.url?eid=2-s2.0-0031632111&partnerID=MN8TOARS

Simple scheme for transmit diversity using partial channel feedback

Conference Record of the Asilomar Conference on Signals, Systems and Computers, 2, 1073–1078. http://www.scopus.com/inward/record.url?eid=2-s2.0-0032260864&partnerID=MN8TOARS

Exploiting input cyclostationarity for blind channel identification in OFDM systems

IEEE Transactions on Signal Processing, 46(2). http://www.scopus.com/inward/record.url?eid=2-s2.0-33747807667&partnerID=MN8TOARS

Control of square-wave inverters in high-power hybrid active filter systems

IEEE Transactions on Industry Applications, 34(3), 458–472.

Inductor design for high-power applications with broad-spectrum excitation

IEEE Transactions on Power Electronics, 13(1), 202–208.

Active filter system implementation

IEEE Industry Applications Magazine, 4(5), 47–63.

Experimental verification of dominant harmonic active filter (D.H.A.F.) for high power applications

Conference Record - IAS Annual Meeting (IEEE Industry Applications Society), 2, 1400–1407. http://www.scopus.com/inward/record.url?eid=2-s2.0-0032308520&partnerID=MN8TOARS

Post-decoding interference cancelation for coded CDMA systems

Proceedings. 1998 IEEE International Symposium on Information Theory (Cat. No.98CH36252), 282 -.

Study of IMBE Vocoder with Speech Enhancement

Journal of China Institute of Communications, 19(4), 43–49.

MEMS-based diffractive optical beam steering system

Proceedings SPIE 3276, Miniaturized Systems with Micro-Optics and Micromechanics III, 3276, 81–87.

Optical gain, hole transport, intervalence band optical transitions in group III nitrides: Envelope function description

Proceedings of the Second Symposium on III-V Nitride Materials and Processes, 97(34), 177–188.

Issues in Chip-Package Codesign with MCM-D/Flip-Chip Technology

Proceedings of the IEEE International Symposium on Chip-Package Codesign, 88–92.

Accurate Lumped-Parameter modeling for dynamic simulation of electrostatic MEMS Actuators

Proceedings International Workshop on Modeling of MEMS Systems.

Flip-chip Power Distribution

Proceedings of the IEEE 7th Topical Meeting on the Electrical Performance of Electronic Packaging, 39–41.

The NCSU Design Kit for IC Fabrication Through MOSIS

Proceedings 1998 International Cadence User Group Conference, 71–80.

Power Reduction by low activity datapath design and SRAM energy models

Proceedings Workshop on Low Power Techniques, ISCA98.

Dynamically Programmable Cache

Proceedings of the SPIE Conference on Reconfigurable Computing, 218–226.

Differentiation Between Electric Breakdowns and Dielectric Breakdown in Thin Silicon Oxides

Journal of The Electrochemical Society, 145(3), 1033.

Tuned amplifiers fabricated in a 0.1-um CMOS technology on bulk, SOI, and SOS substrates

Government Microcircuit Applications Conference Digital Papers, 175–178.

M-STAR: A Device for Continuously Monitoring the Physiological and Biological Properties of Tumors

In Connectivity EXPO’98 Abstract Book (p. 45). Wake Forest University.