Electrical & Computer Engineering

Power Packaging Assembly Challenges

Hopkins, D. C. (2019, March 27). Invited keynote presented at the A.R.E.A. Consortium Meeting Universal Instruments, Binghamton, NY.

1.2 kV, 10 A, 4H-SiC Bi-Directional Field Effect Transistor (BiDFET) with Low On-State Voltage Drop

Kanale, A., Cheng, T.-H., Hanl, K., Baliga, B. J., Bhattacharya, S., & Hopkins, D. (2019, September 29). Presented at the International Conference on Silicon Carbide and Related Materials, Kyoto, Japan.

Characterization of a Topside Cooled Epoxy-Resin Composite Dielectric (ERCD) Package for Bi-Directional Power Switch

Cheng, T.-H., Gao, B., Nishiguchi, K., & Hopkins, D. (2019, October 7). Presented at the ASME International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems (InterPACK), Anaheim, CA.

Advances in Organic Substrate Approaches for High Voltage Power Electronics Packaging

Hopkins, D. C., Cheng, T.-H., Gao, B., & Boteler, L. (2019, October 7). Presented at the ASME International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems (InterPACK), Anaheim, CA.

Designing for Switching Stresses in a Circuit Breaker Application using SiC Semiconductors

Ballard, B., Mehrotra, U., & Hopkins, D. C. (2019, October 29). Tutorial presented at the 7th IEEE Workshop on Wide Bandgap Power Devices and Applications (WiPDA, Raleigh, NC.

Design and Integration of WBG Solid State Circuit Protection

Hopkins, D. C., Ballard, B., & Mehrotra, U. (2019, March 17). Tutorial presented at the IEEE Applied Power Electronics Conference, Anaheim, CA.

Edge Interconnect Packaging of Integrated Circuits for Power Systems

(US Patent No. 10,325,875B2).

Thermal Characteristics and Simulation of an Integrated GaN eHEMT Power Module

2019 21st European Conference on Power Electronics and Applications (EPE '19 ECCE Europe). Presented at the 2019 21st European Conference on Power Electronics and Applications (EPE '19 ECCE Europe).

A High-Bandwidth Resistive Current Sensing Technology for Breakers and Desaturation Protection

2019 IEEE 7th Workshop on Wide Bandgap Power Devices and Applications (WiPDA). Presented at the 2019 IEEE 7th Workshop on Wide Bandgap Power Devices and Applications (WiPDA).

Flexible Large Power Solid State Transformer (FLP-SST)

New Dynamic Power MOSFET Model to Determine Maximum Device Operating Frequency

2019 IEEE Applied Power Electronics Conference and Exposition (APEC). Presented at the 2019 IEEE Applied Power Electronics Conference and Exposition (APEC).

Dynamic modelling of the iron deficiency modulated transcriptome response in Arabidopsis thaliana roots

In Silico Plants, 1(1), diz005.

Dynamic DNA-based information storage

BioRxiv, 836429.

Free-Space Phased-Array Characterization and Calibration Using Code-Modulated Embedded Test

IEEE MTT-S International Microwave Symposium Digest, 2019-June, 1225–1228.

Computational prediction of gene regulatory networks in plant growth and development

Current Opinion in Plant Biology, 47, 96–105.

Flux modeling for monolignol biosynthesis

Current Opinion in Biotechnology, 56, 187–192.

Directions for research and training in plant omics: Big Questions and Big Data

Plant Direct, 3(4), e00133.

Programming Quantum Computers: A Primer with IBM Q and D-Wave Exercises

PROCEEDINGS OF THE 24TH SYMPOSIUM ON PRINCIPLES AND PRACTICE OF PARALLEL PROGRAMMING (PPOPP '19), pp. 451–451.

Board 59: Work in Progress: Industry-based Team Program Reviews for Capstone Design Teams

Gupta, R., & Dunko, G. (2019, June).

A 10-GHz Code-Modulated Interferometric Imager Using Commercial-Off-The-Shelf Phased Arrays

IEEE MTT-S International Microwave Symposium Digest, 2019-June, 1015–1018.