Electrical and Computer Engineering

Works Published in 2003

search works

Displaying works 21 - 40 of 215 in total

Sorted by most recent date added to the index first, which may not be the same as publication date order.

2003 journal article

Measuring Joint Reliability: Applying the Moire Interferometry Technique

Advanced Microelectronics Magazine, 12(5), 17–20.

By: H. Ye, C. Basaran & D. Hopkins

Source: NC State University Libraries
Added: October 28, 2021

2003 journal article

Flip Chip and BGA Solder Joint Reliability

Advanced Packaging, 12(5), 17–19.

By: H. Ye, C. Basaran, D. Hopkins, H. Liu & A. Cartright

Source: NC State University Libraries
Added: October 28, 2021

2003 journal article

Measurement of Electrical Current Density Effects in Solder Joints

Advancing Microelectronics, 30(5).

By: H. Ye, D. Hopkins & C. Basaran

Source: NC State University Libraries
Added: October 28, 2021

2003 conference paper

Partitioning digitally programmable power-control for applications to ballasts

APEC. Seventeenth Annual IEEE Applied Power Electronics Conference and Exposition (Cat. No.02CH37335). Presented at the APEC 2002 - Applied Power Electronics Conference and Exposition, Dallas, TX.

By: D. Hopkins* & J. Moronski*

Event: APEC 2002 - Applied Power Electronics Conference and Exposition at Dallas, TX on March 10-14, 2002

TL;DR: The procession of technology to embed digital power control in power supply circuits, with particular attention to dimmable fluorescent lighting ballasts is described, showing a near optimum match with the evolving system on chip (SoC) approach taken for microcontrollers to provide an integrateddigital power control. (via Semantic Scholar)
UN Sustainable Development Goal Categories
7. Affordable and Clean Energy (OpenAlex)
Sources: Crossref, NC State University Libraries
Added: September 5, 2021

2003 conference paper

Reliability of solder joints under electrical stressing - strain evolution of solder joints

ITherm 2002. Eighth Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (Cat. No.02CH37258). Presented at the ITherm 2002. Eighth Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, San Diego, CA.

By: H. Ye, C. Basaran*, D. Hopkins* & A. Cartwright*

Event: ITherm 2002. Eighth Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems at San Diego, CA on May 30 - June 1, 2002

author keywords: electromigration; Moire Interferometry; electronic packaging; power electronics
Sources: Crossref, NC State University Libraries
Added: September 5, 2021

2003 journal article

Mechanical degradation of microelectronics solder joints under current stressing

International Journal of Solids and Structures, 40(26), 7269–7284.

By: H. Ye*, C. Basaran* & D. Hopkins*

Sources: Crossref, NC State University Libraries
Added: September 5, 2021

2003 journal article

Thermomigration in Pb–Sn solder joints under joule heating during electric current stressing

Applied Physics Letters, 82(7), 1045–1047.

By: H. Ye*, C. Basaran* & D. Hopkins*

Sources: Crossref, NC State University Libraries
Added: September 5, 2021

2003 journal article

Numerical simulation of stress evolution during electromigration in IC interconnect lines

IEEE Transactions on Components and Packaging Technologies, 26(3), 673–681.

By: H. Ye, C. Basaran* & D. Hopkins*

author keywords: deviatoric stress tensor; electromigration; FE; hydrostatic stress; PDEs; stress evolution
Sources: Crossref, NC State University Libraries
Added: September 5, 2021

2003 journal article

Damage mechanics of microelectronics solder joints under high current densities

International Journal of Solids and Structures, 40(15), 4021–4032.

By: H. Ye*, C. Basaran* & D. Hopkins*

author keywords: solder joint; reliability; electromigration; nano-indentation; coarsening
Sources: Crossref, NC State University Libraries
Added: September 5, 2021

2003 journal article

Measurement of high electrical current density effects in solder joints

Microelectronics Reliability, 43(12), 2021–2029.

By: H. Ye, D. Hopkins* & C. Basaran

TL;DR: The initial results show that the measured strain was largely due to thermal stressing versus the current density of 1.8 × 102 A/cm2, and understanding strain evolution in the solder over time is an important step toward developing a damage mechanics model. (via Semantic Scholar)
Sources: Crossref, NC State University Libraries
Added: September 4, 2021

2003 thesis

A novel compiler framework for a chip-multiprocessor architecture with thread-level speculation

University of Illinois at Urbana-Champaign.

By: J. Tuck

Source: ORCID
Added: August 18, 2021

2003 conference paper

Web-based Asset Management Tools

Proceedings of DistribuTech Conference. Presented at the DistribuTech Conference, Las Vegas, NV.

By: J. Hasselstrom, D. Lubkeman, F. Li, J. Wang & Y. Liao

Event: DistribuTech Conference at Las Vegas, NV

Source: NC State University Libraries
Added: March 19, 2021

2003 report

Performance modeling of memory latency hiding techniques

[Technical Report,]. Raleigh, NC: Department of Electrical and Computer Engineering, North Carolina State University.

By: H. Zhou & T. Conte

Source: NC State University Libraries
Added: February 20, 2021

2003 conference paper

Extending OpenMP to support slipstream execution mode

Proceedings - International Parallel and Distributed Processing Symposium, IPDPS 2003, 10.

Contributors: K. Ibrahim n & G. Byrd n

TL;DR: This paper investigates the implementation of an OpenMP compiler that supports slipstream execution mode, a new optimization mechanism for CMP-based distributed shared memory multiprocessors. (via Semantic Scholar)
Source: ORCID
Added: February 15, 2021

2003 conference paper

A new introductory laboratory course for electrical and computer engineering

ASEE Annual Conference Proceedings, 11378–11391. http://www.scopus.com/inward/record.url?eid=2-s2.0-8744285585&partnerID=MN8TOARS

By: M. Öztürk, J. Trussell, C. Townsend, G. Byrd, A. Mortazavi, M. Baran, T. Conte, B. O’Neal, G. Bilbro, J. Brickley

Contributors: M. Öztürk, J. Trussell, C. Townsend, G. Byrd, A. Mortazavi, M. Baran, T. Conte, . B. O'Neal, G. Bilbro, J. Brickley

Source: ORCID
Added: February 15, 2021

2003 report

Code size aware compilation for real-time applications

[Technical Report]. Computer Science Department, University of Central Florida.

By: H. Zhou

Source: NC State University Libraries
Added: February 8, 2021

2003 conference paper

Enhancing Memory Level Parallelism via Recovery-Free Value Prediction

The 2003 International Conference on Supercomputing (ICS'03), 326–335.

By: H. Zhou & T. Conte

Source: NC State University Libraries
Added: February 8, 2021

2003 conference paper

Welcome from the general chair

Technical Digest - International Electron Devices Meeting. http://www.scopus.com/inward/record.url?eid=2-s2.0-0842266682&partnerID=MN8TOARS

By: L. Lunardi, J. Welser & J. Candelaria

Contributors: L. Lunardi, J. Welser & J. Candelaria

Source: ORCID
Added: September 21, 2020

2003 conference paper

Plenary session

Technical Digest - International Electron Devices Meeting, 1. http://www.scopus.com/inward/record.url?eid=2-s2.0-0842288304&partnerID=MN8TOARS

By: L. Lunardi & J. Welser

Contributors: L. Lunardi & J. Welser

Source: ORCID
Added: September 21, 2020

2003 conference paper

Tunable Dispersion Compensation at 10Gb/s and 40Gb/S Using Multicavity All-Pass Etalons

Conference on Optical Fiber Communication, Technical Digest Series, 86, 162–163. http://www.scopus.com/inward/record.url?eid=2-s2.0-1642524225&partnerID=MN8TOARS

By: D. Moss, L. Lunardi, M. Lamont, G. Randall, P. Colbourne, S. Chandrasekhar, L. Buhl, C. Hulse

Contributors: D. Moss, L. Lunardi, M. Lamont, G. Randall, P. Colbourne, S. Chandrasekhar, L. Buhl, C. Hulse

Source: ORCID
Added: September 21, 2020

Citation Index includes data from a number of different sources. If you have questions about the sources of data in the Citation Index or need a set of data which is free to re-distribute, please contact us.

Certain data included herein are derived from the Web of Science© and InCites© (2024) of Clarivate Analytics. All rights reserved. You may not copy or re-distribute this material in whole or in part without the prior written consent of Clarivate Analytics.