Electrical and Computer Engineering

Flip Chip and BGA Solder Joint Reliability

Advanced Packaging, 12(5), 17–19.

Measurement of Electrical Current Density Effects in Solder Joints

Advancing Microelectronics, 30(5).

Partitioning digitally programmable power-control for applications to ballasts

APEC. Seventeenth Annual IEEE Applied Power Electronics Conference and Exposition (Cat. No.02CH37335). Presented at the APEC 2002 - Applied Power Electronics Conference and Exposition, Dallas, TX.

Reliability of solder joints under electrical stressing - strain evolution of solder joints

ITherm 2002. Eighth Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (Cat. No.02CH37258). Presented at the ITherm 2002. Eighth Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, San Diego, CA.

Mechanical degradation of microelectronics solder joints under current stressing

International Journal of Solids and Structures, 40(26), 7269–7284.

Thermomigration in Pb–Sn solder joints under joule heating during electric current stressing

Applied Physics Letters, 82(7), 1045–1047.

Numerical simulation of stress evolution during electromigration in IC interconnect lines

IEEE Transactions on Components and Packaging Technologies, 26(3), 673–681.

Damage mechanics of microelectronics solder joints under high current densities

International Journal of Solids and Structures, 40(15), 4021–4032.

Measurement of high electrical current density effects in solder joints

Microelectronics Reliability, 43(12), 2021–2029.

A novel compiler framework for a chip-multiprocessor architecture with thread-level speculation

University of Illinois at Urbana-Champaign.

Web-based Asset Management Tools

Proceedings of DistribuTech Conference. Presented at the DistribuTech Conference, Las Vegas, NV.

Performance modeling of memory latency hiding techniques

[Technical Report,]. Raleigh, NC: Department of Electrical and Computer Engineering, North Carolina State University.

Extending OpenMP to support slipstream execution mode

Proceedings - International Parallel and Distributed Processing Symposium, IPDPS 2003, 10.

A new introductory laboratory course for electrical and computer engineering

ASEE Annual Conference Proceedings, 11378–11391. http://www.scopus.com/inward/record.url?eid=2-s2.0-8744285585&partnerID=MN8TOARS

Code size aware compilation for real-time applications

[Technical Report]. Computer Science Department, University of Central Florida.

Enhancing Memory Level Parallelism via Recovery-Free Value Prediction

The 2003 International Conference on Supercomputing (ICS'03), 326–335.

Welcome from the general chair

Technical Digest - International Electron Devices Meeting. http://www.scopus.com/inward/record.url?eid=2-s2.0-0842266682&partnerID=MN8TOARS

Plenary session

Technical Digest - International Electron Devices Meeting, 1. http://www.scopus.com/inward/record.url?eid=2-s2.0-0842288304&partnerID=MN8TOARS

Tunable Dispersion Compensation at 10Gb/s and 40Gb/S Using Multicavity All-Pass Etalons

Conference on Optical Fiber Communication, Technical Digest Series, 86, 162–163. http://www.scopus.com/inward/record.url?eid=2-s2.0-1642524225&partnerID=MN8TOARS

Student generated course demos

Proceedings - Frontiers in Education Conference, FIE, 2, F1B13-F1B18.